Zulki’s PCB Nuggets: PCB Microelectronics—Inspection and Calibration

July 18, 2019 | Zulki Khan, NexLogic Technologies, Inc.

Microelectronics manufacturing is the companion of SMT manufacturing and forms PCB hybrid manufacturing. Tools for SMT manufacturing have been around for a long time and have proven their value. Now, with microelectronics, new and different types of high-powered laser microscopes are populating the microelectronics assembly and manufacturing area to provide highly effective inspection and calibration.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

July 17, 2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.



Knocking Down the Bone Pile: BGA and PCB Warpage—What to Do

July 10, 2019 | Bob Wettermann, BEST, Inc.

Warpage of BGA packages or PCBs can occur when any heating and subsequent cooling cycle is gone through. This may leave the package to bow in the middle. Pushing the corners up or downward will show up in bridging (caught on X-ray) or...

One of the best ways to eliminate possible production issues when you handle your SMT work in-house is to ensure that you have a manufacturable design. Thus, there are several factors to keep in mind when reviewing your designs before...

In the first part of this column series about becoming a preferred supplier to your customers, Alfred Macha provides the fundamental concepts to transform your company's culture with Lean Sigma. The approach introduced in this column...

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