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In Part 1 of this two-part column series, I discussed how one can address the challenge of solder balls before completing a build or starting production build. In Part 2, I will explore the second challenge we often hear about: tombstoning.
In the ever-moving tide of technology, the need to innovate requires a constant shift in vision, and this need has never been more evident than in PCB manufacturing. In fact, innovation has become so valuable that PCBs are quickly becoming the currency of technology. Dr. Bill Cardoso explains.
Looking at the SMT industry right now, I see some very interesting things going on with shifts in production locations, ease of manufacturing, and intellectual property (IP) protection. OEMs are bringing production back to the U.S. in...
As the name implies, multi-tier wire bonding involves several levels of wire bonding beyond the single level of wire bonding, which is traditionally used in semiconductor and/or PCB microelectronics assembly. Here, you have two,...
We see orders for a single board, and we see orders for thousands. “A few thousand” falls way outside the realm of “prototype,” but in the startup and open-source worlds, the lines are blurred. Once you order...
Supply Chain Update and the Impact of 5G Interview with Nolan Johnson
David Meyers on Digital Twin and ‘Cobots’ Interview with the I-Connect007 Editorial Team
André Bodegom on European Challenges, Automation, and Automotive Interview with Pete Starkey
The Digital Medical Revolution Interview with Nolan Johnson
Voices Carry by Eric Camden
Are CMs Ready to Embrace Project Management? by Alfred Macha
Electronics Assembly Industry Outlook by Bob Wettermann
