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I recently spoke with Bert Horner of the Test Connection Inc., about the current state of flex and rigid-flex assembly testing. He explained some of the differences between testing flex and rigid PCBs, the requirements for testing specialties such as high-voltage flex, and the added demands of handling flexible circuits.
Nolan Johnson speaks with Oren Manor of Siemens Digital Industries Software about the company’s booth at IPC APEX EXPO, which will highlight a DSI platform meant to help designers find and use components in their designs during these tough supply chain challenges. If you can’t make it to IPC APEX EXPO, don’t worry. We’ll be bringing you interviews with the engineers, managers and technologists who are making a difference in our industry.
Indium Corporation’s Ron Lasky continues this series of columns about Maggie Benson, a fictional character, to demonstrate continuous improvement and education in SMT assembly. In this installment, Maggie and John, new owners of...
The amount of charge generated in an electronics rework and repair area is affected by a variety of factors including but not limited to the materials used, the amount of frictional interaction between materials as well as the...
On balance, this last year goes down as a pretty good one. While we are not as far along in putting the pandemic behind us as we might have hoped, the progress is promising. The economic recovery has been remarkable, despite...
