FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

SMTAI 2018 Closes on a High Note

October 18, 2018 | Barry Matties, I-Connect007

SMTA International 2018, which took place in Rosemont, Illinois is now in the history books. This multi-day event, held October 14-18, at the Donald E. Stephens Convention Center, was packed with keynotes, conferences, lively discussions, committee meetings and a two-day exhibition.

Do's and Don'ts of Thermal Management Materials

October 17, 2018 | Jade Bridges, Electrolube

Selecting a thermal management material that is broadly applicable to a particular electronic assembly and its predicted operating conditions is a good starting point; however, as with many of these things, the devil is very much in the details! Find out the key considerations in choosing your materials.



COLUMNS:

Are Megatrends Putting Your Product at Megarisk?

October 3, 2018 | Eric Camden, Foresite

It took 38 years for radio to get 50 million users, television made it in 13 years, Internet in four, iPod in three, and Facebook in only two years. What these numbers mean to our industry is the need to create electronics at blazing...

Conformal Coatings: An Evolving Science

September 26, 2018 | Phil Kinner, Electrolube

One of the trends impacting the electronics assembly industry is the continuing miniaturization of electronics products. This article sheds more light on coating problems posed by this trend, as well as provide key considerations when...

Filling the Gap: Underfill Rework

September 21, 2018 | Bob Wettermann, BEST, Inc.

Rework technicians must take into account a variety of factors when considering whether or not to rework underfilled components, such as BGAs, CSPs, flip chips, and other component packages on handheld devices. But without a full...

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