FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

Indium Corporation's Brook Sandy-Smith discusses ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.

The Survey Said: Industry Optimistic After Strong 2017

May 24, 2018 | I-Connect007 Research Team

During recent trade shows and conferences, we spoke with a variety of fabricators and assembly providers. They had one thing in common: Every company achieved strong growth in 2017, and shared a positive outlook about the future. This year, the industry is optimistic, driven by positive economic outlook, growing customer demand, and new technologies and vertical markets, among others.



COLUMNS:

Fact or Myth: Do 80% of M&A Deals Fail?

May 9, 2018 | Tom Kastner, GP Ventures, Ltd.

We are often asked by business owners if the commonly quoted figure is true that 80% of mergers fail to meet expectations after closing. There is a fair amount of research on large ($1 billion+), public deals that suggests that the...

Device 'Dead Bugging'

April 20, 2018 | Bob Wettermann, BEST, Inc.

"Dead bug" attachment of electronic components is a way of building functioning electronic circuits by soldering the parts directly together or by soldering miniature jumper wires between the component leads and the PCB...

This issue 5G: Testing the Future Impact Featuring:

5G Requires New Approach to Testing, by Stephen Las Marias, I-Connect007
Challenges and Opportunities in Testing 5G, a conversation with Keysight
DFT Strategy Necessary for 5G Assembly, a conversation with Asteelflash
5G: Testing the Future Impact, by Stephen Las Marias, I-Connect007

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