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Brian D’Amico, president of MIRTEC, talks with I-Connect007 Managing Editor Andy Shaughnessy about some of the latest 3D AOI challenges, including dealing with highly reflective surfaces of solder joints or wafer-level die, which make it impossible to characterize in 3D. He says it's not just plain SMT boards anymore, but an integration of wafer-level manufacturing, which they see as coming down more and more.
At the SMTA International 2017 exhibition in Rosemont, Illinois, Gary Tanel, president of the SMTA Dallas Chapter, speaks with I-Connect007 Publisher Barry Matties on a myriad of topics, including the goal of the SMTA as an industry association, and how it is helping the industry evolve. They also discussed challenges and strategies in bringing more young people to the industry.
When it comes to considering applications in electronics and microelectronics industry, over last three decades, the industry has shied away from using bismuth (Bi), at least not in standard practices in mass production. However, an...
Hon Hai Precision Industry is the world’s largest contract electronics manufacturer. Last week, the company announced plans to build a $10 billion LCD panel plant in Wisconsin. Hon Hai acquired Japanese electronics manufacturer...
Any increase in material cost based solely on an assembly operation's geographic location could, in itself, cause a condition that would not allow a turnkey electronic product assembler to successfully compete on the global...
