Research and Development Leads to Biogreen Coatings

November 29, 2021 | Nolan Johnson, I-Connect007

In the November 2021 issue of SMT007 Magazine, we featured a pre-productronica interview with Phil Kinner of Electrolube, who shared a preview of the company’s newest products that the company planned to launch at the show in Munich. "This is the first show that we’ve been to in a while, and we have a couple of new products we are launching," said Kinner. "One is a thermal gap filler, designed in China by our Chinese team with a thermal conductivity of 6 watts per meter K, which is really decent. We also have a new conformal coating with a high degree of bio-renewable source materials."

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

November 26, 2021 | Nolan Johnson, I-Connect007

If you’re in the United States like I am, and if you celebrated with a traditional Thanksgiving dinner, like my family did, then you just might have fallen asleep sitting up in a chair (or in my case, stretched out on the couch) and missed some of the highlights in the news this week. Never fear, I woke up early to bring the top five news items you should know for this week. We have industry bookings and sales news from IPC, some news from the flex sector, an explanation of induction lamination from Happy Holden, and two different takes on “sustainability.”



Maggie Benson's Journey: Taking a Team Approach

November 24, 2021 | Ronald C. Lasky, Indium Corporation

Editor’s note: Indium Corporation’s Ron Lasky continues this series of columns about Maggie Benson, a fictional character, to demonstrate continuous improvement and education in SMT assembly. Maggie was working in her...

Standard of Excellence: Great Customer Service is a Two-Way Street

November 22, 2021 | Team ASC, American Standard Circuits

We all enjoy great customer service. Actually, we love great customer service. We love it so much that we are always happy to tell everyone we know when one of our vendors provides us with great customer service. We actually want to...

Knocking Down the Bone Pile: Methods for Underfilled Component Rework

November 17, 2021 | Bob Wettermann, BEST, Inc.

Products such as engine control modules, drones, smartphones, and other handheld communication devices, which are designed for high reliability and require high processing power, often have a BGA or CSP package as the processor....

Test and Inspection Featuring:

  • Test Strategies and Pain Points with Bert Horner
  • Where AI Meets Test and Inspection with Yan Manissadjian, Alexia Vey, and Jesse Dowd
  • Market Changes Require Re-evaluating Your Testing Processes with Bob Neves
  • Research and Development Leads to Biogreen Coatings with Phil Kinner
  • Conformal Coatings and Legacy X-rays with Ed Moll
  • Keysight’s Massively Parallel Board Test with Christopher Cain
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