FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

David Bergman from the IPC speaks with I-Connect007's Pete Starkey about how the CFX format has been developed, and the excited response to the CFX Visitor Experience at the IPC APEX EXPO 2018.

At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.



COLUMNS:

Device 'Dead Bugging'

April 20, 2018 | Bob Wettermann, BEST, Inc.

"Dead bug" attachment of electronic components is a way of building functioning electronic circuits by soldering the parts directly together or by soldering miniature jumper wires between the component leads and the PCB...

How to Prepare for a Smooth Post-M&A Deal Transition

April 5, 2018 | Tom Kastner, GP Ventures, Ltd.

Selling a company is an exciting process, as well as time-consuming, stressful, and complex. Both sellers and buyers are sometimes so caught up in the deal that they forget to properly plan the post-deal integration....

One World, One Industry: Skilled Talent—Can We Meet Rising Demand?

April 2, 2018 | John Mitchell, IPC--Association Connecting Electronics Industries

In 2018, the U.S. GDP is expected to continue its rise, while unemployment rates are expected to drop further. Experts agree that the global economy is also showing signs of...

This issue Automotive Electronics Featuring:

Copyright © 2018 I-Connect007. All rights reserved.