David Bergman from the IPC speaks with I-Connect007's Pete Starkey about how the CFX format has been developed, and the excited response to the CFX Visitor Experience at the IPC APEX EXPO 2018.
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
"Dead bug" attachment of electronic components is a way of building functioning electronic circuits by soldering the parts directly together or by soldering miniature jumper wires between the component leads and the PCB...
Selling a company is an exciting process, as well as time-consuming, stressful, and complex. Both sellers and buyers are sometimes so caught up in the deal that they forget to properly plan the post-deal integration....
In 2018, the U.S. GDP is expected to continue its rise, while unemployment rates are expected to drop further. Experts agree that the global economy is also showing signs of...
Vehicle Electrification: Disrupting the Automotive Industry and Beyond, by Chandran Nair, National Instruments
Solving Reliability and Thermal Management Challenges in Automotive Electronics, an interview with Paul Salerno
System-Driven Approach Ensures Automotive Electronics Assembly Success, an interview with Mathieu Kury
Under the Hood: Solder Joint Reliability, by Burton Carpenter, NXP Semiconductors Inc.
Automotive Electronics Still in the Front Seat, by Stephen Las Marias, I-Connect007