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Current IssueBreaking High-speed Material Constraints
Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems. Learn more in this issue.
Level Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
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In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
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IPC SummerCom to Co-Locate with EWPTE
January 31, 2023 | IPCEstimated reading time: Less than a minute
The IPC SummerCom Standards Development Committee Meetings will be held in-person, from May 13–18, 2023, at the Wisconsin Center in Milwaukee, Wisconsin. IPC SummerCom will be co-located with the Electrical Wire Processing Technology Expo (EWPTE), the industry’s exclusive trade show for decision-makers who design, specify, purchase, install, sell, maintain or manufacture electronic cable assemblies, cord sets, wiring harnesses, and other related products.
IPC SummerCom is all about IPC Standards—welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Moreover, registering to IPC Summercom provides attendees free access to EWPTE. The IPC Standard Development Committees cover a range of topics, including assembly and joining; assembly equipment, base materials, cleaning and coating; electronic product data description; embedded devices; flexible and rigid-flex printed boards; management; printed electronics; and more.
For more information or to register, contact Kim DiCianni, CEM, at KimDiCianni@ipc.org, or visit https://www.ipc.org/event/ipc-summercom.
Suggested Items
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
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Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.