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SEMI, UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States
February 6, 2024 | SEMIEstimated reading time: 1 minute
SEMI announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. Offered by SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) and funded by the National Institute of Standards and Technology (NIST), the Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP) highlights critical areas of development needed to establish advanced packaging facilities on U.S. soil.
Based on the Heterogeneous Integration Roadmap (HIR), the guide incorporates a manufacturing approach to implement the HIR. Some 100 chip industry veterans from more than 40 companies collaborated with representatives from academic institutions, industrial consortia, and government agencies to develop the guide.
Addressing hardware and software tools, manufacturing processes, and supplier infrastructure, the guide covers tools, processes, standards, and interdependencies that enable advanced packaging for high-performance computing (HPC), medical, health and wearables applications.
“The MRHIEP drills down into operational objectives by examining current capabilities and highlighting critical areas of development needed for onshored manufacturing to be successful in the U.S.,” said Melissa Grupen-Shemansky, SEMI CTO. “The guide provides vital support for implementation of the HIR, a comprehensive document addressing the global supply chain for heterogenous integration.”
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05/13/2024 | ACDiACDi, a leading provider of electronics manufacturing services, today announces the expansion of its East Coast presence and manufacturing capabilities with the acquisition of a fourth manufacturing plant in Kilmarnock, Virginia. The company signed an asset purchase agreement with QinetiQ to acquire their Virginia facility and its assets, including SMT, wave soldering, AOI and SPI equipment. The deal brings ACDi to 4 East Coast locations with a total of 9 SMT lines.
LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry
05/13/2024 | LPKFThe semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing.
ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus
05/13/2024 | SEMIThe 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/10/2024 | Marcy LaRont, PCB007 MagazineSpring is a renewal each year as dormant flora bloom, and baby ducklings and geese are ever present in local bodies of water. Even though it is beginning to get hot, I love this time of year in Arizona, with the sun waking me around 5 a.m. It fills me with an energy that I often lose in the dark winter months. Wherever you find yourself in the world, I hope you are enjoying Spring and that you are filled with energy and enthusiasm for all the great work part of our daily lives in this industry.
ViTrox Presents Next-Gen Intelligent Manufacturing Solutions at SEMICON Southeast Asia 2024
05/10/2024 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is pleased to announce its participation as an exhibitor and Platinum sponsor at SEMICON Southeast Asia 2024! Join us from May 28-30 at Booth #1504 in Malaysia International Trade and Exhibition Centre (MITEC), KL, to experience our advancement in technology and manufacturing.