AIM to Highlight Lead-Free Alloy at productronica China 2018


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AIM Solder will exhibit at productronica China 2018, scheduled to take place March 14-16, 2018 in Shanghai, China. AIM will highlight their revolutionary REL61 lead-free solder alloy, along with their full line of solder assembly materials.

REL61 was developed to provide PCB assemblers and designers with an enhanced reliability, cost-effective replacement for SAC305 and other low/no silver alloys. REL61 outperforms all common lead-free alloys in durability, wetting performance, thermal cycling performance, and BTC void performance.  Available in paste, wire and bar solder formats, REL61 can be incorporated into all phases of PCB assembly.  For the most extreme operating environments be sure to learn about REL22TM.  AIM’s innovative REL alloys are engineered for reliability, usability, and cost effectiveness.

AIM will highlight its full line of advanced solder materials, including its solder paste, liquid flux in addition to their exciting new high reliability alloys. To discover all of AIM’s products and services, visit the company at productronica China at the Shanghai New International Expo Centre in booth E2.2166 and speak with one of AIM’s knowledgeable staff members.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

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