AIM to Highlight REL61 and REL22 at SMTA West Penn Expo


Reading time ( words)

AIM Solder announces their participation at the SMTA West Penn Expo & Tech Forum, scheduled to take place March 28th, 2018 at the DoubleTree Monroeville Hotel in Monroeville, Pennsylvania. AIM will highlight their revolutionary REL61 and award-winning REL22 lead-free alloys along with their full line of solder assembly materials.

REL61 was developed to provide PCB assemblers and designers with an enhanced reliability, cost-effective replacement for SAC305 and other low/no silver alloys. REL61 outperforms all common lead-free alloys in durability, wetting performance, thermal cycling performance, and BTC void performance.  Available in paste, wire and bar solder formats, REL61 can be incorporated into all phases of PCB assembly. 

AIM will also highlight its full line of advanced solder materials, including its solder paste, liquid flux solder alloys, and its newly developed and award-winning REL22 solder alloy for extremely harsh environments. To discover all of AIM’s products and services, visit the company at the SMTA West Penn Expo & Tech Forum for more information.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share


Suggested Items

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

09/12/2018 | Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.

Whitepaper: Electronics Cleanliness Testing

09/11/2018 | Jason Fullerton, Alpha Assembly Solutions
This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.



Copyright © 2018 I-Connect007. All rights reserved.