AIM to Highlight REL61 at the SMTA Michigan Expo & Tech Forum


Reading time ( words)

AIM Solder is pleased to announce their participation at the SMTA Michigan Expo & Tech Forum, scheduled to take place on May 22, 2018 at Laurel Manor in Livonia, MI. AIM Solder will highlight its novel REL electronic solders, REL22 and REL61.

AIM’s new alloys provide the PCB assembly industry with unique solutions to address the limitations of current industry offerings. REL22 is an award-winning, high reliability alloy with durability characteristics that double the reliability of SAC305 in harsh environments. REL61 is a low silver solder alloy that solves the process challenges associated with many other low/no silver solder alloys. With a 10°C lower melting temperature and superior wetting performance versus SAC305, REL61 can lower process temperatures, prevent PCB damage, and reduce costs and waste. AIM’s REL alloys are available in paste, wire and bar formats and are engineered for reliability, usability, and cost effectiveness.

Along with their REL alloys, AIM will showcase its full line of advanced solder materials, including its solder pastes, liquid fluxes, tin/lead and lead-free alloys. To discover all of AIM’s products and services, visit the company at the SMTA Michigan Expo & Tech Forum for more information and to speak with one of AIM’s knowledgeable staff members.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share

Print


Suggested Items

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

Solder Paste Selection/Qualification

01/16/2019 | Stephen Las Marias, I-Connect007
In a recent SMT007 survey, we asked the following question: " What are your challenges when it comes to solder paste selection/qualification?" Here are just a few of the replies, slightly edited for clarity.

Who’s the Best of the Best in Hand Soldering?

01/11/2019 | Nolan Johnson, I-Connect007
IPC APEX EXPO 2019 will include the new IPC World Championship Hand Soldering and Rework Competition on the expo floor on January 29 and 30. Twelve competitors from Britain, China, France, Germany, India, Indonesia, Japan, South Korea, and Thailand will compete for the crown and the title of the first-ever IPC World Hand Soldering and Rework Champion.



Copyright © 2019 I-Connect007. All rights reserved.