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Shanghai-based Armada Trade and Development Co. Ltd is the exclusive distributor of stencils manufacturer Christian Koenen GmbH in China. In this interview during NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.
He also discusses their stencil technology that ensures accurate paste release and helps customers to achieve first-pass yields.
Watch the interview here.
Barry Matties, I-Connect007
Stefan Theil, product manager at Factronix, discusses the growing need for cleaning in European electronics manufacturing and the demands he's facing from customers when it comes to finer pitches, automation, and environmental concerns.
T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.
By A. Lifton, P. Salerno, J. Sidone and O. Khaselev, Alpha Assembly Solutions
Shrinking QFN package sizes and power requirements are driving new developments in micro-fluxed preform. Learn what factors contribute to an optimal solution.