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As conductors and circuit traces become narrower, "How clean is clean?" is getting more and more challenging to answer, as what is acceptably clean for one industry segment may be unacceptable in others.
To educate the industry in the technological developments in all areas of cleaning and coating applied to electronics assemblies, the IPC and SMTA will be holding the High-Reliability Cleaning and Conformal Coating Conference on November 13–15, 2018, in Schaumburg, Illinois.
The event will include a technical conference, two half-day tutorials, networking activities and tabletop exhibits. Tutorials will provide practical information on materials, equipment and methodologies at the basic-to-intermediate levels. The technical conference will feature advanced-level presentations from subject-matter experts, emphasizing case studies of real-world problems along with solutions.
For more information, click here.
Gregory Vance, Rockwell Automation Inc., and Todd Vick, Universal Instruments Corp.
One of the major challenges for an electronics assembly manufacturing engineer is determining how an SMT machine will impact throughput. Typically, an SMT equipment supplier will ask for a few products to simulate the throughput capability of their machine. Unfortunately, if the engineer works in a high-mix, low-volume environment, he may need to know the impact of a new machine on 1,000 or more products.
Real Time with...IPC
Indium Corporation's Brook Sandy-Smith discusses ionic process residues on PCB assemblies and introduces the concept of "PMI-squared" (process material interaction investigation), the topic of an IPC Technical Buzz Session at IPC APEX EXPO 2018.
Real Time with...IPC
Brian D'Amico, president of Mirtec Corp., speaks with I-Connect007 Technical Editor Pete Starkey about the challenges of miniaturization, increasing component density, and the shadowing of small components by taller ones, and how Mirtec has developed its inspection technology to ensure they remain at the leading edge.