SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
Nolan’s Notes: Do More, Get More
Global Sourcing Spotlight: Don’t Be Afraid of Global SourcingKIC Intros Auto Profiling and Intelligent Network Software Ecosystem
June 12, 2018 | KICEstimated reading time: 1 minute
KIC has announced a new automatic profiling system with network software for real-time dashboard, data sharing and traceability storage. The new RPI i4.0 automatically acquires profile data from each product soldered in the reflow oven, in real-time.
This new ecosystem offers full thermal process traceability, reduced scrap and rework, improved production line utilization and fast defect troubleshooting. Advanced data search and communication features save engineers valuable time.
The profile is compared to the relevant process window for traceability and can alarm instantly on out of spec conditions. Advanced search and filter functions on product name, customer name, time period and more, instantly provide pertinent data for deeper insight and effective troubleshooting.
With RPI i4.0 all relevant data can connect to the factory MES to be easily shared with personnel, and can be accessed from any authorized PC or mobile device. The enhanced level of automation delivers improved line utilization and productivity.
About KIC
Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.
KIC products include the KIC SPS, K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.
Share on:
Suggested Items
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Real Time with... IPC APEX EXPO 2024: Advancements in Laser Depaneling with LPKF
04/24/2024 | Real Time with...IPC APEX EXPOJake Benz, LPKF sales manager for North America, discusses the company's advancements in laser depaneling. LPKF has introduced a green wavelength laser for processing rigid FR-4 circuit boards, bringing significant gains in processing speeds to market. The company transitioned from IR CO2 to UV wavelength due to heat and burning issues.
KYZEN to Focus on AQUANOX A4618 at SMTA Wisconsin Expo & Tech Forum
04/22/2024 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place Tuesday, May 7, 2024 at the Four Poins by Sheraton, Milwaukee Airport in Milwaukee, WI.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.