Session 1 of IPC-SMTA Conference to Focus on Cleanliness Considerations


Reading time ( words)

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13–15, 2018 at Chicago Marriott in Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.  

Session 1 of the technical conference focuses on "Cleanliness Considerations for Building Reliable Hardware."

Mark McMeen of STI Electronics will discuss improved methods for "qualifying soldering and cleaning processes that result in acceptable levels fo flux and other residues."

Ravi Parthasarathy of Zestron Corporation will discuss "Jet Printing Cleaning Challenges," test methods and best practices for cleaning these assemblies.

Doug Pauls of Rockwell Collins will discuss "Development and Validation of an SIR-Based Process Evaluation System and Methodology" for determining acceptable cleanliness levels.

Axel Vargas of Lockheed Martin Missel System will discuss "Methods for Developing and Validating Rinsing Electronics Devices Following the Cleaning Process in Both Batch and Inline Cleaning Machines."

Vladimir Sitko of PBT Works will discuss "Visual Methods for Determining Time to Clean Flux Residues Under Leadless and Bottom Terminated Components."

Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.

Click here for the detailed agenda outline.

Share

Print


Suggested Items

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.

Laserssel Brings High-speed Soldering to New Application Areas

06/10/2019 | Barry Matties, I-Connect007
In this interview with I-Connect007, Denis Barbini, general manager of Laserssel, talks about the company's new laser-selective reflow solution aimed at reducing a typical reflow oven’s 10-minute cycle down to just 10 seconds as well as the overall benefits manufacturers could see from streamlining this process.

Minimizing Voids in Solder Joints

06/07/2019 | Rehm Thermal Systems
Dr. Hans Bell of Rehm Thermal Systems, Henryk Maschotta of Thales Deutschland GmbH, and Dr. Heinz Wohlrabe of TU Dresden presented the results of their project on reducing void content in the solder joints of land grid arrays (LGAs) at a soldering seminar during the Technology Days of the recent SMTconnect show in Nuremberg.



Copyright © 2019 I-Connect007. All rights reserved.