-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium Corporation’s Proven Jetting Paste Recommended by NSW Automation
December 3, 2020 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation’s newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSW Automation for use with their newest microfluid dispenser, SD1.
The SD1 Automated Intelligent Micro-dispenser dispenses at a minimum of 80µm, the smallest solder dot in the world, with gaps as small as 20µm, while downsizing the equipment footprint up to 48%. Thanks to the development effort between the two companies, Indium12.8HF is the recommended product to be used on this system to achieve those fine dots and lines. This no-clean, halogen-free solder paste helps deliver exceptional microdispensing performance in standalone applications, such as system-in-package (SiP), jetting into cavities, stencil-replacement, shield-attach, and microBGA. It also complements the stencil printing of Indium Corporation’s best-selling solder paste, Indium8.9HF.
“This is an exciting time for our friends at NSW Automation and for us as well,” said Kenneth Thum, Senior Area Technical Manager at Indium Corporation, who has been working with NSW Automation on the fine-feature dispensing projects. “As more applications begin to adapt finer pitches and smaller packages, it’s critical that we deliver reliable equipment and materials that provide solutions to today’s challenges.”
Additionally, Indium12.8HF:
- Offers a flexible metal load (78-85%) to provide optimal dispensability
- Fine-powder adaptability: Type 5, Type 6, Type 7
- Has a clear residue with minimal flow-out
- Significantly reduces head-in-pillow (HIP)
- Eliminates or significantly reduces graping
- Minimizes reflow spatter
Visit Indium.com to learn more about Indium Corporation’s new jetting and microdispensing paste.
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.