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Indium Corporation continues to expand its flux portfolio with WS-823—a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate.
SA-Dip%20flux.jpgWhile the standard ball-attach process requires two steps, especially on a Cu-OSP substrate, WS-823 is a halogen-free, water-wash flux designed for a single-step ball-attach process that eliminates the prefluxing step in order to create reliable ball-to-pad joints.
- Tackiness suitable for holding solder spheres in place during reflow
- Excellent solderability on a wide range of surfaces, including AuNi and oxidized Cu-OSP
- Uniform pin transfer over extended periods, eliminating changes in joint quality over time and uneven deposit sizes, which can lead to “missing ball”
- A formula engineered for low-voiding, thereby increasing joint strength
- Good cleanability with room temperature DI water, avoiding the formation of white residue
Andy Shaughnessy, I-Connect007
I recently spoke with Leo Lambert, vice president of technology for EPTAC, about the training company’s newest classes and his plans for the upcoming SMTA International. The event, co-located with the Medical Device & Manufacturing (MD&M) Show, takes place in Minneapolis Oct. 31—Nov. 3. It’s never a dull moment in this industry and Leo takes a few minutes to talk about his company’s certification efforts, what’s planned for SMTAI, and where some of this technology is headed. Swallowing a pill that measures diagnostics? It’s a great time to be in the industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.