Segment 8 of Koh Young Webinar Series: Going the Distance With AI


Reading time ( words)

Watch & Learn!

I-Connect007 Releases Segment 8 of Koh Young Webinar Series: ‘Converting Process Data Into Intelligence’ 

At just over seven minutes, the eighth episode, “Going the Distance With AI” is now available to view. 

Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to... SMT Inspection, Today, Tomorrow and Beyond, topic experts Joel Scutchfield and Ivan Aduna share highly focused educational information on the use of data gathered during the inspection process.

In recent times, artificial intelligence has demonstrated promising potential across a variety of industries, from self-driving vehicles to virtual doctors, and it has far-reaching applications within the manufacturing sector. By using the right mixture of AI technologies, manufacturers can boost their efficiency, improve flexibility, speed up processes, and even achieve self-optimizing processes. The SMT industry is no exception and, with a chronic shortage of skilled labor, AI seems a natural fit. Equipment providers are enabling the smart factory of the future by adopting AI to generate “knowledge” from “experience.”

This entire 12-part webinar series can be viewed in an hour and covers a comprehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes.

Visit Converting Process Data Into Intelligence and start watching, free, today! 

Share

Print


Suggested Items

Segment 9 of Koh Young Webinar Series: Koh Young Auto Programming (KAP)

11/24/2021 | I-Connect007 Editorial Team
In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success. At just over 8 minutes, the ninth episode, “AI in Action” is now available to view. In this segment, viewers will learn about 3D profilometry technology and how it converges with Koh Young’s proprietary AI technology to deliver true automatic programming. This geometry-based software solution reduces the programming process to minimize time to production and reduce costs.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Excerpt: The Printed Circuit Assembler’s Guide to… Smart Data, Chapter 2

04/21/2021 | Sagi Reuven and Zac Elliott, Siemens Digital Industries Software
Companies have been collecting data in large volumes. Highly varied data from manufacturing operations comes in quickly that needs to be validated, and its value prioritized so that it can be turned into something useful—transformed from big data to smart data. The amount of data available has grown exponentially into big data. Twenty years ago, a PCB work order resulted in 100 data records, megabytes of data; today, it is 10 billion records, terabytes of data. The investment in collecting this data and storing it is high. However, without a way to analyze the data, without analytics, it will not result in ROI.



Copyright © 2021 I-Connect007. All rights reserved.