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Pin and Slant Fin Heat Sinks from ATS Offer Economical Electronics Cooling
February 28, 2022 | Advanced Thermal Solutions, Inc.Estimated reading time: 1 minute
Advanced Thermal Solutions, Inc. (ATS) is now providing Pin and Slant Fin heat sinks made from lightweight, extruded aluminum to provide low-cost cooling solutions for many hot PCB components.
Pin Fin sinks have a high efficiency design that harnesses cooling airflow from any direction. They reliably perform in spatially constrained PCB layouts where the airflow direction is variable. The pin fin field has low pressure drop characteristics for effective cooling in low airflow environments. The combined large surface areas of the pins and base increases overall heat sink performance. Where space allows, taller and denser pin fin fields, with higher aspect ratios to their bases, further increase heat dissipating surfaces to provide even higher cooling performance.
For limited airflow situations in direction-specific applications, Slant Fin heat sinks provide substantial surface area, and therefore high cooling performance. The slanted fin field extends slightly beyond their base dimensions. Like with Pin Fin heat sinks, Slant Fin sinks are fabricated from single-piece extruded aluminum, which minimizes the thermal resistance from their base to their fins
Both Pin Fin and Slant Fin heat sinks are available for component sizes 10 x 10mm up to 60 x 60mm, and standard heights from 2 to 25mm.
Pin and Slant Fin heat sinks in all standard sizes can be attached with double-sided thermal tapes. Larger sinks can be further secured with clip-type hardware, including Z-clips, and ATS’ proven maxiGRIP and superGRIP easily-installed attachment systems.
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Indium Corporation Technical Manager to Present at SMTA Taiwan Tech Forum
03/12/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager Jason Chou will present at the SMTA Taiwan Tech Forum on March 26 in Taoyuan City, Taiwan. Chou’s presentation will highlight the growing demand for high reliability and low-temperature solder solutions brought on by the rapidly developing electric vehicle (EV) and artificial intelligence (AI) industries.
BTU to Unveil Aurora in the US at the 2024 IPC APEX EXPO
03/12/2024 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will introduce its award-winning Aurora Reflow Oven Platform, at the upcoming 2024 IPC APEX EXPO.
Indium Corporation Experts to Present at SEMI THERM
03/07/2024 | Indium CorporationIndium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.
Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 3
03/01/2024 | I-Connect007 Editorial TeamChapter 3 of this book is titled Thermal Resistance/Impedance and Measurement. To assess a vendor’s claims about the performance of an IMS, it is important to know the test method that has been applied. Designers may need to rely on empirical data and past experience to develop an IMS specification to meet their needs.