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The U.S. Patent and Trademark Office has issued Patent No. 10,780,516 protecting Electrovert’s DwellFlex 4.0 Variable Contact Wave Solder Nozzle. Invented by ITW EAE engineers, John Dautenhahn and Greg Hueste, the DwellFlex 4.0 is the first nozzle that allows the wave width to be adjusted on-the-fly variable board types are run through the wave. This ensures solder contact time is optimized for a high mix of board types without losing production time to change conveyor speeds.
Optimizing the length of time the PCB is in contact with the wave is critical to achieving proper topside hole fill without introducing copper dissolution. DwellFlex 4.0’s software compares the recipes between the products and adjusts the wave contact length, pump speed, blower speeds, and fluxer settings on-the-fly as needed. It takes less than ten seconds to make the adjustment between high mass and low mass boards and ensure superior solder results.
DwellFlex 4.0 is a single wave solution that includes both the turbulent and laminar dynamics of the wave within one continuous solder wave, eliminating the temperature drop that occurs between typical dual-wave configurations This single wave solution improves nozzle efficiency, promotes better topside hole fill, and reduces flux degradation.
Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.
Nolan Johnson, I-Connect007
Nolan Johnson talks with Shaun Dykes, a 50-year expert in the mining industry. Dykes gives a concise primer on mining development, and the amount of time and effort required to develop and supply the mineral resources we depend upon for the manufacture of printed circuit boards. There are many factors that play into when and where a mine is developed—and what can prevent a mine from ever producing minerals.
I-Connect007 Editorial Team
In a recent conversation with Ventec’s Alun Morgan, the I-Connect007 Editorial Team discussed, among several topics, semiconductor packaging developments. Industry insiders will know that, when you get Happy Holden and Alun Morgan talking about emerging technology trends, there will be insights shared.