Reading time ( words)
Dr. Jennie Hwang will deliver two courses at IPC APEX EXPO 2012: PoP and BTC Assembly: Material, Process and Reliability and Preventing Production Defects and Failures.
In an effort to maximize yield and reliability, Dr. Hwang leverages on the confluence of her in-depth knowledge and real-world experiences to address current issues related to SMT production and newer package assembly during the conference by offering two half-day courses, PD-15 and PD-26.
PD-26: PoP and BTC Assembly- Material, Process and Reliability
Monday, February 27 9:00 a.m. to 12:00 p.m.
With the new and emerging developments in packaging and assembly, this course focuses on package-on-package (PoP) and bottom termination components (BTCs, e.g. QFN, LGA, MLF, SON, DFN). The important aspects of materials, techniques, processes, and reliability for both lead-free and SnPb products will be addressed. The industry trends and the evolutionary path of advanced packages, e.g. PoP and various BTCs, will be outlined. The best practices of assembling BTCs and PoPs, including solder material, PCB assembly process, and rework, as well as the prevalent production defects and practical remedies, will be discussed. Applicable practices in solder paste deposition techniques (printing versus dipping) and halogen-free solder paste, as well as the renewed interest in vapor phase soldering and the optimal reflow profiling for lead-free soldering will be addresssed. The course also discusses solder joint reliability of PoP and BTC assembly and what it takes to make reliable solder joints. Attendees are encouraged to bring their issues for discussion.
- Overview – semiconductor, packages, and assembly;
- Advanced packages – new or emerging packages;
- PoP technology – evolution, challenges;
- PoP assembly – material, process, best practice;
- PoP assembly – production defects and remedies, rework process;
- BTC (QFN, LGA, MLF, SON, DFN) – challenges, material, process;
- BTC (QFN, LGA, MLF, SON, DFN) assembly – production defects and remedies;
- BTC (QFN, LGA, MLF, SON, DFN) solder joint – rework optimization;
- Halogen-free solder paste – best practices;
- Solder paste printing – paste rheology, stencil design, and performance;
- Solder paste dipping – paste rheology, process parameters;
- Reflow techniques – convection versus vapor phase;
- Reflow profiling for lead-free assembly – best practice, optimal profile;
- Solder joint reliability of PoP and BTCs – fundamentals;
- Case studies – reliability of PoP and BTCs; data versus performance criteria; and
- Attendee issues.
PD-15: Preventing Production Defects and Failures
Monday, February 27 2:00 p.m. to 5:00 p.m.
Considering the new and anticipated developments in packaging and assembly, this course focuses on how-to prevent such issues and take remedial measures of the prevailing production defects through the understanding of potential causes. Issues/defects addressed include PCB bare board issues, PCB pad cratering, BGA head-on-pillow defect, passive 01005 issues, copper dissolution and lead-free thru-hole barrel filling problem. PCB thermal properties and halogen-free PCB laminates will be discussed. New developments in tin whisker and mitigating measures will also be outlined. Attendees are encouraged to bring their issues for discussion.
- PCB – thermal properties for lead-free assembly;
- PCB bare board – thermal properties versus defect prevention;
- PCB – halogen-free laminates;
- PCB pad cratering – causes, solutions;
- BGA head-in-pillow defect – causes, factors, and remedies;
- Copper dissolution – process factors, impact on thru-hole reliability, mitigation;
- Pb-free thru-hole barrel filling – material, process, solder joint integrity;
- Tin whisker – new developments, mitigation;
- Passive 01005 assembly – process, factors, best practice; and
- Attendee issues.
About Dr. Hwang
Dr. Hwang is a pioneer and long-standing leader in SMT manufacturing and lead-free electronics. Since its inception, she has been a major contributor to the implementation of surface mount manufacturing through hands-on production and has served as an advisor to OEMs, EMS providers and U.S. government, providing solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications, including U.S. Department of Defense F-22 program. Dr. Hwang has received numerous honors and awards including the U.S. Congressional certificate of recognition and achievements; honorary Doctoral degree, WITI International Hall of Fame; “R&D Star-to-Watch” by Industry Week; YWCA Women of Achievement Award; and she was elected to the National Academy of Engineering. She holds several patents and has 350+ publications to her credit, including the sole authorship of several internationally-used textbooks, and is a speaker in innumerable international and national events. Additionally, she has served on the Board of NYSE Fortune 500 companies, and on various civic, government, and university boards and committees, including U.S. Commerce Dept. - Export Council; U.S. Defense Dept. - Globalization Committee, Forecasting Future Disruptive Technologies Committee; and has chaired the National Laboratories Assessment Panel – NIST-EEEL. Her formal education includes Harvard Business School Executive Program, Columbia University Business School Corporate Governance program, and four academic degrees (Ph.D. M.S., M.S., B.S.) in Metallurgical Engineering and Materials Science, Inorganic Chemistry, Liquid Crystal Science and Chemistry, respectively. She has held various senior executive positions with Lockheed Martin Corporation, SCM Corporation, Sherwin Williams Company, and IEM Corporation. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University and serves on the University’s Board of Trustees.
For more information, and to register, CLICK HERE