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The SMTA International Technical Committee invites you to submit an abstract for SMTAI 2012, the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount, advanced packaging, and related technologies, scheduled for October 14-18, 2012 in Orlando, Florida.
Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Materials must be original, unpublished, and non-commercial in nature.
Papers are being solicited in the following categories:
- Advanced packaging/components;
- Business/supply chain;
- Emerging technologies;
- Harsh environment applications;
- PCB technology; and
- Process control.
Abstracts (300 words) are due March 12, 2012 and must be submitted online. Proposals are also solicited from individuals interested in teaching educational courses related to surface mount technology, advanced packaging, and electronics manufacturing. Half-day courses (3.5 hours) are preferred and must also be submitted online by March 12, 2012.
Speakers and participants benefit by making contributions to the industry and through recognition by colleagues for sharing research work and findings. To acknowledge and reward exceptional achievement, $1,000 and a recognition plaque are given for the "Best of Conference Presentation," "Best of Proceedings Paper," and "Best International Paper."
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, visit www.smta.org.