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Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?
Brian O’Leary, head of Indium's e-Mobility & Infrastructure, reacts to SMTAI’s keynote delivered by John Thomas of Autel. The title of the keynote presentation was "The Electronic Vehicle (EV) Conundrum" which addressed the sheer scale of the transition to e-Mobility that we are now undertaking. In this interview, O’Leary discusses some of the technical challenges faced in product development by Indium (and everyone else) as well as the new IPC e-Mobility council. Participation in the council is open to everyone.
Understanding that batteries will power our increasingly electrified future is an important focus for the electronics manufacturing industry. While most manufacturers will simply benefit from an increased demand for additional boards...
I last wrote about cybersecurity nearly 10 years ago in my column, “Cybersecurity—from Boardroom to Factory Floor.” So, where do we stand on cybersecurity? As the digital world continues pushing ahead, it comes with...
The IPC Student Chapter network has been a wonderful program allowing students interested in pursuing a career in electronics manufacturing with the opportunity to connect with industry members. These connections are important for...
