Alpha Introduces Ultrafine Cored Wire for Fine-Pitch Component Soldering and Rework


Reading time ( words)

Alpha Assembly Solutions is introducing ALPHA SAC305 Ultrafine Cored Wire for use in attaching or repairing very fine pitch components approaching 0.20mm.

“With the increase of solder joint density and miniaturization, ALPHA SAC305 Ultrafine Cored Wire is an ideal solution where solder paste reflow or other soldering applications are not compatible to the design,” said Bernice Chung, Global Portfolio Manager for Wave Soldering at Alpha Assembly Solutions, a part of the MacDermid Performance Solutions Group of Businesses. “Fine pitch PCB assemblies have higher quality and reliability standards, which requires precise solder wire feeding volume and non-skip solder feeding. Ultrafine cored wire delivers consistent diameter size and flux continuity to ensure unfailing wire feeding, especially in robotic soldering, such as laser soldering technologies.”

ALPHA SAC305 Ultrafine Cored Wire offers fast soldering performance and has passed the most stringent reliability tests. It can be used for any customer who has previously approved larger diameter wire using ALPHA Telecore HF-850, Telecore XL-825 or Telecore Plus core fluxes. Provided in cored wire for convenient use, ALPHA SAC305 Ultrafine Cored Wire is available in 0.2mm, 0.15mm and 0.1mm to fit different process requirements.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

Share


Suggested Items

Survey: Low-Temperature Soldering on PCBAs

11/14/2018 | Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.

Investigation on the Assembly Process for m03015 and a Brief Look at m0201 Components

11/14/2018 | David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.

Alpha Assembly Solutions on Training, Education, and Low-Temperature Soldering

11/07/2018 | I-Connect007 Editorial Team
In this interview, Jason Fullerton of Alpha Assembly Solutions discusses the benefits and challenges of low-temperature soldering. He also highlights the biggest concerns he’s currently seeing in the industry, including young engineers lacking hands-on manufacturing experience and training, voiding and head-in-pillow issues, and low-temperature soldering demands.



Copyright © 2018 I-Connect007. All rights reserved.