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RTW NEPCON CHINA: Mycronic Meets High-volume Demand with Solder Jet Printing
05/25/2017 | Real Time with... NEPCON China
Business and Technical Developments at Super Dry Totech
05/24/2017 | Pete Starkey, I-Connect007
RTW NEPCON China: Data I/O on Securing the Supply Chain
05/23/2017 | Real Time with... NEPCON China
Grow Your Own Training Programs
05/22/2017 | Davina McDonnell, Saline Lectronics
The Role of an Account Manager Within an EMS Provider
05/19/2017 | Neil Sharp, JJS Manufacturing
The Benefits of Postponement Manufacturing When Outsourcing
With the world changing at an incredible pace, OEMs agile enough to respond rapidly to customer demand stand a greater chance of survival compared to those that are not. This article looks into the late stage configuration technique and some of the benefits an OEM can expect to gain when outsourcing to an EMS provider that offers this service.
RTW NEPCON CHINA: Mycronic Meets High-volume Demand with Solder Jet Printing
Mycronic VP for Global Dispensing and Managing Director Clemens Jargon discusses how the flexibility of solder jet printing helps reduce downtime in the line, thus increasing total line speed and enabling it to keep up with high-volume demand.
Business and Technical Developments at Super Dry Totech
At the recent SMT Hybrid Packaging show in Nuremberg, Germany, I-Connect007 Technical Editor Pete Starkey visits Super Dry Totech and spends a few minutes with CEO Jos Brehler and Sales Manager Terry Morgan to talk about the rationale behind ASYS Group's acquisition of stake in Super Dry Totech, as well as the latest technology developments happening at the company.
RTW NEPCON China: Data I/O on Securing the Supply Chain
At the recent NEPCON China show in Shanghai, Anthony Ambrose, president and CEO of Data I/O Corp., discusses the cybersecurity challenges facing the electronics manufacturing industry today amid the proliferation of connected devices and the Internet of Things.
Grow Your Own Training Programs
Negative connotations about manufacturing jobs as dirty, repetitive, and boring have plagued the industry for the last 20 years. Manufacturing lacks the sex appeal that jobs in tech use to entice potential employees. Due to the great shortage of skilled workers and the lackluster image of the industry, manufacturing companies have had to re-evaluate and re-design their HR strategies to recruit, hire and train new employees.
The Role of an Account Manager Within an EMS Provider
How do you start to compare EMS providers when it comes to their account management team? Does it really matter what role they play? And how crucial do you believe they are in helping you achieve your outsourcing objectives? This article looks in-depth at some of the common activities an account manager typically carries out on your behalf when you decide to partner with an EMS provider.
Zestron Technical Workshop Tackles Next Generation of Cleaning
Zestron recently held a technical workshop in Alabang, Muntinlupa City in the Philippines to help users address their cleaning challenges amid advancements in semiconductor device packaging.
Mentor Graphics: Connecting the Manufacturing Environment
Oren Manor serves as the director of business development for Mentor Graphics Valor Division. In this interview with SMT Magazine, Manor discusses the latest updates in their OML community, their case study regarding Phoenix Contact’s implementation of their IoT solution in its facilities, and what’s new in ODB++.
Why You Shouldn't Hide Your Supply Chain Issues
From a natural or man-made disaster that is completely out of your control to a breakdown in communication, there are many reasons why an OEM might find themselves faced with a problem in their supply chain. Whatever the reason for the disruption, one thing is certain: if you are planning to work with, or are already working with, an EMS provider, you shouldn't hide your supply chain issues.
Voiding Control at High-Power Die-Attach Preform Soldering
Voiding in the solder joint is a concern for high-reliability and high-performance devices. This paper discusses a study on voiding behavior of large pad high-power devices simulated with Cu coupon to Cu coupon sandwiches. A flux-coated preform was studied in this assembly, with variation in solder alloy type, quantity of solid flux coated on solder preform, Cu coupon pre-oxidation extent, reflow temperature, and pressure exerted onto the sandwich during reflow.
Enhancing Recruitment Efforts with Public-Private Partnerships
After nearly two decades of the dominance of the service economy, manufacturers in all industries have a challenge: recruiting and training the next generation of manufacturing employees. This article details how one EMS company has been addressing that challenge through collaborative efforts with educational institutions, other businesses and regional support networks.
SMTA West Penn Expo: Who Says There’s No Such Thing as a Free Lunch!
Bill Capen of DRS Technologies, the president of the SMTA West Pennsylvania Chapter, speaks with I-Connect007's Patty Goldman about the recent West Penn Expo & Tech Forum. He also talks about the group's upcoming chapter meetings this year, and the latest developments happening in the military segment.
The Benefits of Applying Flux Directly to a Micro BGA
Technology trends continue to drive miniaturization in electronic components. As a result, product designers are often forced into specifying smaller and smaller devices on their bill of materials. Sometimes, miniature devices offer OEMs cost savings, which is seen as a good thing; other times, there is simply no choice.
Manufacturing Through the Eyes of Human Resources, Recruitment and New Hire Training
Perhaps more important than the technology and tools a manufacturing company has are its people. People are what make a company truly great and the process of recruiting talented, skilled, dedicated employees and training them properly for success is an important aspect of any manufacturing company.
Keeping an Eye on the Next Generation
Why should a company in our industry dedicate hours to providing professional development to a group of temporary student interns? Why should they open their doors to kids, some of whom haven’t even entered high school? For Indium, the short answer is, it makes them better. Read on to find out why.
IMPACT 2017: Electronics Industry Leaders Meet with Members of Congress and Trump Administration on Capitol Hill
IPC places a high priority on making our presence known in the halls of government to educate our government officials on the policies that will strengthen the advanced manufacturing industry.
Blackfox Program Trains Vets for Manufacturing Jobs
It's harder than ever for managers in the PCB manufacturing industry to find qualified staff, with some reporting that positions are remaining open for months at a time. On the other hand, there are thousands of soldiers, sailors, airmen and marines transitioning out of the service each year and seeking good jobs. In this interview, Allen Dill, president of Blackfox, discusses their program that offers manufacturing training to veterans, even while they are still in the military.
The Challenge of Filling PCB Assembly Positions
U.S. manufacturers are having a difficult time filling open positions. They cannot find workers with the necessary skills to fill the openings. If we look specifically at the PCB assembly industry, the rhetoric is similar. There are more openings than people to fill them. The discussions reveal that lower wages, lack of skills, and sometimes the reported low unemployment rate in the United States is part of the problem.
Predicting Solder Paste Transfer Efficiency and Print Volume
Being able to predict the transfer efficiency and print volume reproducibility of solder paste are valuable data points for any circuit assembly process. Knowing how many good boards that can be expected from a jar of solder paste is critical for a contract manufacturer working on paper thin margins.
The Complex World of Soldering
Industry veteran Happy Holden and Saline Lectronics Senior Process Engineer Cathy Cox discuss the various challenges and issues that users face in soldering, including the lack of a "one-size-fits-all" approach in the process, and some key factors that the PCB assembly industry should consider when it comes to different applications and markets.
RTW NEPCON China: Viscom Talks 3D AOI Developments
Guido Bornemann, head of sales for Asia at Viscom, speaks with I-Connect007 Editor Stephen Las Marias about inspection challenges such as false calls and improving first pass yields. He also talks about the latest developments in 3D AOI to address these issues as well as test strategies to achieve zero defects.
RTW NEPCON China: Metcal Highlights Innovation in Hand Soldering Technology
At NEPCON China, Bryan Gass, vice president of Metcal, discusses how their Connection Validation soldering station will revolutionize the hand soldering technology industry.
Virtex on Military and Aerospace Requirements
Brad Heath, VirTex CEO, and Upinder Singh, Vice President and General Manager at VirTex MTI, discuss their company's military and aerospace business, and how they are addressing the latest demands and requirements from their customers.
What a Tangled (Soldering) Web We Weave!
Soldering remains one of the most critical processes in the PCB assembly industry. Which is why it is of the utmost importance that the soldering process should be perfect. But soldering is just too complex a process, and further complicating the situation, the requirements and technologies vary between our industry’s market segments. There are just a lot of factors to consider before you put your boards into the reflow and let them run.
Your In-depth Guide to Reducing Electronics Manufacturing Waste
Waste is a common problem within the electronics manufacturing industry. Whether large volumes of faulty smartphones need recalling or small batches of complex PCB assemblies need reworking, waste can be time consuming and costly to rectify. This article discusses principles such as DMAIC, Six Sigma and Lean manufacturing to help you implement strategies to minimize your waste output.
Achieving Successful Flex Circuit Assemblies
In this article, Yousef Heidari, vice president of engineering at EMS firm SigmaTron International, talks about the varying challenges in flex-circuit assembly. Chief among these are the solder paste printing process, especially for designs that have multiple areas with fine-pitch components, as well as the subsequent handling of the assembly before final product integration.
The Building Blocks of Industry 4.0
At the recent IPC APEX EXPO, Kevin Decker-Weiss, director of sales at CircuitByte, joins panellist from Mentor Graphics and EMS firm Saline Lectronics in a roundtable on the building blocks of Industry 4.0 hosted by Scoop. Here is his take on that panel and the show.
JJS Stresses Need for Baking Prior to Flex Circuit Assembly
From an assembly perspective, baking the flex circuits prior to manufacturing assembly is crucial as they can be susceptible to delamination. In this interview, Russell Poppe, director of technology at JJS Manufacturing explains why, as well as discusses other challenges in flex circuit assembly and strategies to address them.
RTW IPC APEX EXPO: Metcal Brings Disruptive Technology in Hand Soldering
Christopher Larocca, president and CEO of OK International (of which Metcal is a division), tells I-Connect007 Publisher Barry Matties their strategy for improving the hand solder process. He describes a lack of process feedback to the operator as a core problem inherent in the hand soldering process, and discusses how OK International has developed an innovative solution to address the issue.
Fixturing: Key to Accurate Flex Circuit Assembly
Adrian Nishimoto, operation manager at Spectrum Assembly Inc., talks about the critical factors to consider during flex circuit assembly, such as fixturing and accurate thermal profiling. He also mentions why jet printers are suitable for use in assembling flex circuits.
Rework and Repair on Flex Circuits
With this surge in usage of flex, the standards for rework—replacing devices while still meeting the initial specification and functionality—and repair—repairing the physical damage on a flex circuit—of flex circuits has not kept pace.
Strategies for Addressing Flex Circuit Assembly Pain Points
In an interview with SMT Magazine, Steve Fraser, VP of Operations at Firstronic, discusses the key factors that have the greatest impact on the quality of flex circuit assemblies, the challenges they face during assembly, and their strategies to ensure the reliability of the products.
How to Solder SMT Components with Varying Solder Paste Heights
While miniaturized components offer product designers some benefits, such as energy efficiency and the ability to build in greater functionality, mixing "old and new" technology together on the same PCB design can add complexity at the build stage. As a result, it is sometimes necessary to change the way solder paste is applied to the PCB during production.
Supportive Tooling: The Magic Ingredient for Flex Circuit Assembly
Flex circuits have changed the way product development engineers can design and package their electronic products. Flex applications have opened the doors for PCBAs to move out of square, box enclosures and fit into small, tight, even oddly shaped three-dimensional spaces that can withstand harsh vibration and multiple flex uses. While these flex assemblies may perform in the same way a traditional rigid PCBA does, they have their own set of assembly rules and manufacturing nuances.
Dry Storage Cabinets' Role in Industry 4.0
At IPC APEX EXPO 2017, Rich Heimsch, Super Dry’s Director of the Americas, discusses the electronics manufacturing industry’s different versions of Industry 4.0, and his company's strategies in dealing with all of them. He also talks about Super Dry's latest storage developments.
Miniature Components on PCBs Requires Flexible Cleaning Methods
Smaller, more densely populated circuit boards make the issue of managing faults, quality and product longevity highly challenging. This is why so many companies consider their PCB cleaning as a mission-critical process. If the cleaning is not effective the device simply will not function reliably for the required life of the product.
Navigating the Complex World of Flex Circuit Assembly
We recently conducted a survey on flexible printed circuits to know more about the challenges that designers, fabricators, and assemblers face when dealing with flex circuits. We asked what steps in their processes have the biggest effect on yields; the challenge they face when dealing with flex circuit materials; as well as the factors that have the greatest impact on the quality of their flex circuit design, fabrication and assembly.
Assembly of Flexible Circuits
No matter the method, the assembly of electronic flexible circuits is tedious because of its inherent flexible nature. Therefore, we must give extra attention to the assembly process. This article details some of the key considerations when assembling flexible circuits.
What are the Most Important Principles of Lean Manufacturing?
Lean manufacturing is nothing new, but it remains an important philosophy for manufacturers seeking to grow and effectively contend in a competitive, global environment. Essentially, it provides you with the tools to successfully identify and eliminate waste within your operation.
Alpha Papers Investigate High-Reliability Solder Alloys
During SMTA International, Morgana Ribas, manager of Metals Technology Group at Alpha Assembly Solutions, presented a pair of papers that focus on the company’s reliability testing of solder alloys. I-Connect007 Managing Editor Andy Shaughnessy sat down with Morgana to discuss these papers, and some of the surprising results that the testing yielded.
Evaluating a PCB Assembler
When it comes to technology and quality, an SMT assembler's capabilities will be reflected when you go through the key elements in the SMT process. This article provides key points to consider in evaluating a PCB assembler, which allows you to test whether your circuit boards assembled in that factory conform to your required standard.
Electrolube Talks Technologies Targeted at Automotive and LED Applications
Electrolube's Phil Kinner, global head for the conformal coatings business, talks about the trends shaping the company’s product innovation strategies, and their latest solutions and technologies to help address their customers’ greatest challenges.
Should You Use Your CEM Partner's Direct Ship Fulfillment Services?
Gone are the days when OEMs simply outsourced their printed circuit board assemblies to contract electronic manufacturers (CEMs). Today, many CEMs offer a much broader range of services, including an end-to-end outsourcing solution – the end point of which is direct ship fulfillment, whereby the CEM sends fully manufactured and tested products directly to the end customer.
Alpha on New Technologies to Tackle Voiding
Tom Hunsinger, vice president of marketing at Alpha Assembly Solutions, discusses with SMT Magazine how their company is addressing voiding—one of the greatest challenges in soldering. He talks about the latest market development trends that are shaping product innovation strategies at Alpha. Hunsinger also details some of their latest solder technologies, and how they are helping their customers address their soldering challenges.
Successful, Long-Term Growth at Prime Technological Services
Publisher Barry Matties sat down with Prime Technological Services CEO Greg Chesnutt at IPC APEX EXPO, to glean how they continue to find success and have been able to maintain such an impressive growth rate over the last four years.
Goepel electronic Talks Test and Inspection Innovations
Thomas Wenzel, managing director of the Embedded JTAG Solutions Business Development at Goepel electronic, discusses the latest technology innovations happening in the test and inspection segment, and the market trends shaping them.
RTW IPC APEX EXPO: Ray Prasad Discusses Revised IPC-7530 Reflow Profile Guidelines
IPC Hall of Famer Ray Prasad, chairman of the IPC-7530 committee, provides an overview of the newly revised IPC-7530, which provides users with guidelines on how to successfully profile and characterize PCB assemblies with high levels of efficiency.
Conflict Minerals – A Mixed Message?
While the EU is taking a more considered but arguably progressive approach towards banning conflict minerals, the US, in contrast, looks to be heading towards a relaxation or even abandonment of its rules.
SMT Xtra Discusses Expansion Plans in the US
At the IPC APEX EXPO 2017 event in San Diego, SMT Xtra's Alexandra Stovin, marketing and public relations manager, and Paul Pittman, sales manager for the United States and Canada, speaks with I-Connect007 Technical Editor Pete Starkey about their company’s expansion plans in the U.S. and the benefits they offer their customers.
RTW IPC APEX EXPO: Alpha Highlights Technologies Dedicated to Eliminating Solder Voids
Robert Wallace, marketing manager for the Americas at Alpha Assembly Solutions, discusses their new product introductions for this year and their level of customer support as these products are rolled out. He also talks about how these technologies are helping address the issue on solder voiding.
How Servitisation Can Enable Manufacturing Sales Growth
OEMs and EMS providers must implement strategies that enable sales growth – and one such strategy is servitisation, which is about putting the needs of your customers first.
RTW IPC APEX EXPO: Nordson Highlights Improvements in Dispensing and Conformal Coating Systems
Roberta J. Foster-Smith, global marketing communications manager for Nordson ASYMTEK, discusses the continued improvements in Nordson's dispensing and conformal coating equipment, especially when it comes to automation, precision and consistency in delivering ever-finer deposits to meet industry demands and customer needs.
RTW IPC APEX EXPO: Indium Discusses Industry Trends and Reliability Issues
Indium Corp. Product Manager Chris Nash talks with I-Connect007 Technical Editor Pete Starkey about how they are helping customers address their reliability issues, and discusses the success of their "Avoid the Void" campaign.
RTW IPC APEX EXPO: KIC on Smart Factory Technology Approach in Thermal Ovens
Bjorn Dahle, president of KIC Thermal, discusses with I-Connect007 Guest Editor Dick Crowe their approach to measuring temperatures in thermal ovens and networking the information to a main frame, to enable the process engineer to statistically monitor a specific process.
RTW IPC APEX EXPO: Alpha Highlights Solder Reclaim Technology
Mitch Holtzer, director of Americas Reclaim Business for Alpha Assembly Solutions, discusses the company’s reclamation technology, which takes solder dross, used solder paste, and solder paste debris and converts it into reusable soldering materials. He also talks about how solder reclamation can help sustainability efforts, and how it helps customers when it comes to their waste materials.
RTW IPC APEX EXPO: Manncorp on Having a Solutions-centric Approach
Manncorp father-son team Henry Mann and Kyle Mann talk with I-Connect007 Guest Editor Kelly Dack about providing excellent guidance, service, training and support for companies who may be unsure of the best route to take in selecting the right SMT equipment.
How Can I Compare EMS Providers and Create My Shortlist?
Finding the right EMS provider for your business can be a challenge. And trying to compare EMS suppliers and create a shortlist is hard work. Unfortunately, there is no ultimate cheat sheet to help you find the perfect partner. But here's 15 or so questions that you may ask, in order to start collating meaningful data to be able to starting making informed comparisons between EMS providers you are considering partnering with.
RTW IPC APEX EXPO: Mentor Graphics Finishes Traceability Standard in Record Time
Michael Ford of Mentor Graphics and Editor Andy Shaughnessy discuss Mentor's work with traceability processes, including the new IPC traceability standard that was finished in record time.
RTW IPC APEX EXPO: Thomas Scales of Saline Lectronics Discusses Internet of Things
Thomas Scales of Saline Lectronics speaks with Guest Editor Dick Crowe about their company's approach to offering networking and process control solutions in the automated factory.
RTW IPC APEX EXPO: Mirtec Discusses Latest Developments in Inspection Technologies
Mirtec President Brian D’Amico talks about the latest in 2D and 3D AOI and SPI, and how to provide smaller users with affordable high-technology systems. He also talks about the sales success of the MV-6 OMNI series in-line full-3D AOI machine, which features advanced features such as 15-megapixel top-down camera and 3D digital multi-frequency Moire.
RTW IPC APEX EXPO: CyberOptics' Subodh Kulkarni Discusses Ultra-High-Resolution AOI
Dr. Subodh Kulkarni discusses the new bleeding-edge AOI technology CyberOptics has developed that will advance vision technology to a level not achievable today. MRS technology combines accuracy with speed, which have been mutually exclusive in the past.
RTW IPC APEX EXPO: 3D AOI Update With MEK
Henk Biemans of MEK Europe discusses with I-Connect007 Editor Andy Shaughnessy their latest developments in 3D AOI, and their efforts to educate their customers about this growing market.
RTW IPC APEX EXPO: Indium’s Eric Slezak Talks Project 99
Indium Corporation's Eric Slezak talks with I-Connect007 Guest Editor Steve Williams about the launch of their new Project 99 wave solder process flux system. Indium has created an exciting new spin on this technology by using a comic book theme, with "villains" representing common wave solder defects and "superheroes" representing their flux solutions to combat the problems.
Industry 4.0: Nine Key Points Electronics Manufacturers Must Not Ignore
The Fourth Industrial Revolution is nothing if not massive and complicated. There is a huge amount of information out there, some useful and some perhaps less so. But, among the hype, there are a few consistent themes that really must not be ignored by manufacturers wishing to remain competitive in the future.
RTW IPC APEX EXPO: Electrolube Discusses New Conformal Coating Technologies
Phil Kinner, technical director of the coatings division at Electrolube, discusses with I-Connect007 Guest Editor Dick Crowe the latest trends happening in the coatings industry, and how their solutions help customers enhance the reliability of their electronics assemblies.
RTW IPC APEX EXPO: Kyzen’s Thomas Forsythe Talks Latest Developments in Aqueous Cleaning
Thomas Forsythe, executive vice president of Kyzen Corp., talks about the advantages of real-time concentration monitoring, data management and access to data as aqueous cleaning moves towards Industry 4.0.
Metcal Brings Big Science and High Reliability to Hand Soldering
Recently, Judy Warner visited the Metcal facility in Southern California and meet with Product Support Engineer Robert Roush. They talked about Metcal's patented hand-soldering technology, which promises to bring a new level of science and control to the world of hand-soldering.
RTW IPC APEX EXPO: Rehm Highlights Reflow Improvements for Reliable Solder Results
Michael Hanke, CCO of Rehm Thermal Systems, highlights the latest developments in their reflow solutions, which are targeted at improving the reliability of the soldering process. He also discusses their complete solution, which is inline with the Industry 4.0 trend.
RealTimewith...IPC: Mycronic Highlights Latest Capabilities of Jet Printing
Nico Coenen, global sales director of jet printing at Mycronic, discusses the latest developments in their jet printing technology. He also highlights how these advances align with their Mycronic 4.0 strategy.
Real Time with...IPC: Cogiscan Discusses Connectivity Solutions to Enable Industry 4.0
Francois Monette, VP Sales and Marketing at Cogiscan Inc., talks about how the industry can meet the challenge of connecting different machines, software and enterprise systems to enable Industry 4.0 for the electronics assembly industry.
Real Time with...IPC: CalcuQuote on Risk Assessment and RFQ Management
Chintan Sutaria, president of CalcuQuote, discusses how their RFQ management system, with its risk assessment feature, helps EMS customers improve their supply chain. He also talks about their new BidCQ solution is improving the bidding process.
Real Time with...IPC: Tim O'Neill Discusses Latest Developments in Lead-Free Soldering Market
With RoHS requirements in full swing, companies must adapt and adapt quickly as lead based soldering will be completely phased out by 2019 in Europe.
Real Time with...IPC: BEST Talks Rework Challenges and Opportunities
Bob Wettermann, president of BEST Inc., talks about the challenges in rework, and how his company is helping their customers address these problems. He also discusses his paper presentation at this week's technical conference.
Real Time with...IPC: Alpha Discusses Improving LED Reliability Issues
At this week's IPC APEX EXPO 2017 in San Diego, California, Steve Godber, LED Commercial Manager at Alpha Assembly Solutions, discusses with I-Connect007's Stephen Las Marias the reliability and voiding challenges in the LED market, and how the company is helping their customers address these issues through their solder technologies.
Bringing SMT Assembly In-House: Case Studies of the Effects on Lead Time, Inventory, Quality, and Overall Cost
A growing number of low- to medium-volume manufacturers of specialized electronic products are reaping the rewards of bringing their SMT assembly in-house. How have some of these companies justified the cost of their endeavors? In this article, three OEM companies share their experiences.
11 Points to Consider When Buying Selective Soldering Equipment
Although there are clear benefits from investing in a selective soldering equipment, there are also a number of considerations to make prior to purchase. This article looks at 11 points that require further thought, to ensure you select the right piece of selective soldering equipment for your products.
Taking the "Process Approach" to RFQs in Electronics Contract Manufacturing
The ISO 9001:2015 standard can be applied to any organization, any management system and any process. While it is generic in its application, the specific implementation can be the difference between lagging and leading results. This article reviews how the process approach applies specifically to the request for quote process in the EMS industry.
Applying the New IPC Standard for Traceability Makes Compliance and Reporting Easier
IPC has created IPC-1782, a new standard and specification for traceability practices across all levels of electronics manufacturing, and specifically for electronics assembly. With this new standard, companies that are practicing basic levels of traceability can evolve to higher levels, and will be able to clearly define the expectations of what is required for compliance and conformance to customer needs.
What’s Driving the Rapidly Changing Electronics Assembly Industry
Since the EMS landscape has become so competitive, staying on top of new advances in technology and being able to rapidly adapt to changing customer needs, market demands, trends and technological advances is critical. This article highlights some examples of how electronics assembly technology developments have impacted the EMS industry in recent years and will likely continue shaping the industry in the future.
Continuous Improvement in Electronics Manufacturing
With so many variables and "opportunities" to create waste, electronics manufacturing services (EMS) companies have an on-going challenge to identify, address and then eliminate inefficient processes. This is where a continuous improvement approach can help.
The Shape of Things to Come
Where is our industry going? The beginning of a new year provides a good opportunity to look into the crystal ball and foretell what we think will be. So what are the general drivers of change in the high tech electronic product assembly business, and what specific new product and process types do we see that are a result of those drivers?
Achieving Repeatable, Consistent Control over the Selective Soldering Production Process
Selective soldering is a process with more than 100 different parameters that may impact soldering performance. A robust selective soldering process should have a wide process window that is able to handle variations in material quality. In this paper, critical process parameters are discussed as well as methods that can be used to widen the process window.
Investing in New Technologies
Electronics manufacturers are beginning to consider investing in new systems to take their processes to the next level. In our recent survey on the topic of new technology, the top reasons cited by manufacturers to invest in new technologies are to increase efficiency, improve yield, reduce cycle time, and the advance capability of the process.
Turning the Relationship Between the Electronic Product Assembly Employer and Recent Graduates Upside Down
The post-secondary educational system must change from being reactive to our industry’s (high tech electronic product assembly business) needs to being proactive. Students that graduate should act as change agents, challenging a company’s status quo by bringing the latest design, production equipment and process techniques to their new employers from their academic experience.
What to Look for When Auditing an Electronics Manufacturing Facility
Although a large amount of research can be carried out online when selecting an EMS partner, the only real way to satisfy an OEM whether an EMS provider will be a good fit or not is to meet the team and audit their processes. This article lists the approach many OEMs take and highlight some of the key questions they ask.
The Impact of Via and Pad Design on QFN Assembly
Thermal via arrays under QFN components are used to conduct heat away from the device. However, thermal vias can create more voids or result in solder protrusion onto the secondary side. This paper discusses a study on the impact of via size and via design on QFN voiding and solder protrusion.
Reflections on 40 Years of Test and Measurement and What Lies Ahead
Dr. James Truchard, President, CEO, and Cofounder of National Instruments, has penned his reflections on the last 40 years driving and leading some of the greatest progress and innovations the test and measurement industry has seen. In the article, he also leaves us with his thoughts on how he envisions the future to be.
The Time Has Come for Jet Printing
At the recent NEPCON South China 2016 trade show in Shenzhen, Thomas Bredin, area sales manager at Mycronic, discusses with I-Connect007's Stephen Las Marias the latest developments in jet printing technology, and their recent acquisition of Shenzhen Axxon Automation.
Effect of Solder Composition, PCB Surface Finish and Solder Joint Volume on Drop-Shock Reliability
Lead free solder joint reliability in drop shock loading has been a recurring issue in mobile and handheld consumer electronics. Changing solder composition may offer an opportunity to improve joint drop reliability. This study focuses on different failure modes in circuit board assemblies as observed based on solder composition, board surface finish, and solder joint volume.
Evaluation of the Use of ENEPIG in Small Solder Joints
When soldering to ENEPIG, all of the palladium is dissolved into the solder joint, and creates a palladium-rich region at the base of the solder joint. The shrinking solder joint sizes due to the ever decreasing size of parts cause the relative size of this palladium-rich microstructure to grow relative to the overall joint thickness. This study evaluates the impact of industry standard Pd thicknesses on thin solder joints through shear testing.
Six Sigma: What is it and How is it Used in Electronics Manufacturing?
Six Sigma is a defined, data-driven methodology aimed at process improvement and consistent output in manufacturing. This article discusses how it is used in electronics manufacturing, and the benefits it offers companies that have implemented it.
A New Organizational Model Using Logic, Cost-Effectiveness and Customer Service, Part 2
In previous articles, Tom Borkes talked extensively about one of the controllable components of labor cost: the counterweight to competing against low labor rates—using automation to reduce labor content. Over the next few months he will drill down into the other controllable component of labor cost: indirect labor.
More Than Just Dry Air: Controlling Oxidation and Intermetallics in Moisture-Sensitive Devices
Our new columnist Richard Heimsch will be focusing on the management of moisture sensitivity in his column “More Than Just Dry Air.” His inaugural article talks about controlling oxidation and intermetallics in moisture-sensitive devices.
Plating and Surface Finish: Assemblers' POV
Joemar Apolinario and Dnichols Dulang of EMS firm Integrated Micro-Electronics Inc. discuss with SMT Magazine the impact of plating and surface finishes on electronics assemblies. They highlight the impact on solderability, the problems with complex components and packages, as well as parameters to consider when it comes to surface finish selection.
How to Choose Your Outsourcing Project Team
When you decide to outsource your manufacturing operation to an EMS provider, you not only have to choose the right partner – you also have to select your in-house outsourcing project team. With so many important decisions to make, it's easy to feel overwhelmed at times. But with the right people in situ, you will be perfectly placed to achieve success. Here's how you should go about assembling your outsourcing project team.
Choosing the Correct Flux—Advantages/Disadvantages
While often overlooked, the flux chosen for the selective soldering process has a great impact on solder joint quality, long term reliability and overall selective soldering performance. This article outlines the critical factors of commonly available selective soldering fluxes and how they impact the soldering quality, reliability and equipment performance.
The Influence of Clean Air on the Value-Added Chain in Electronics Production
A multitude of different processes in modern electronics production—from connection and separation technologies, surface processing such as marking and drilling, the utilisation of fluxes, up to production processes such as soldering, welding and gluing—generate harmful substances that might have extreme health impacts and affect production plants and products.
5 Reasons Why OEMs Outsource to EMS Providers
Why do original equipment manufacturers (OEMs) outsource to electronics manufacturing services (EMS) providers? This article provides five reasons why OEMs venture down an outsourcing path, and the benefits they gain along the way.
Reducing Warpage on BGAs During Rework
This article highlights one of the challenges associated with BGA rework--the effect of device warpage. To address this, Bob Wettermann writes about strategies to reduce device warpage on BGAs to avoid shorts and open circuits post rework.
Editor's Note: Understanding Plating and Surface Finishing
This month’s issue of SMT Magazine focuses on the impact of plating and surface finishing in electronics assembly. True, plating and surface finishing may be more directly significant in PCB fabrication, but surely they are important issues as well when it comes to the assembly side. In fact, according to our recent survey, 82% of the respondents said surface finishing impacts their assembly process.
Breaking Down the Long, Complex Sales Cycle in the EMS Industry
The EMS industry is still considered a young industry, with roots based in the early contract manufacturing days of small harness and PCBA shops. This article discusses how the demand creation process has morphed since the EMS industry's birth around 30 or so years ago into what we might consider as typical in the contract electronics manufacturing industry today.
Successful Sales Strategies
At the recent NIDays 2016 event in Singapore, Matej Krajnc of National Instruments speaks with I-Connect007's Stephen Las Marias about the challenges for sales and marketing executives in the electronics manufacturing industry, effective sales strategies, and key attributes of a sales person. He also shares his outlook on some of the key technology trends for next year.
How to Build Up Trust in a Manufacturing Outsourcing Relationship
When you, as an OEM, entrust part or all of your manufacturing operation to an EMS provider, you want to know that this fundamental aspect of your business is in safe and capable hands. It takes time to establish trust. So how can you build it up into a strong and permanent structure? Read on.
Front Lines: Sales—a.k.a., Trench Warfare!
In his inaugural article for his column Front Lines, Craig Arcuri writes about sales—real sales—not pop sales ideas, not sales jargon of the day, not flavor of the month tactics. He talks about sales in the trenches, and provides simple steps to build a sales foundation that will help your company generate more sales.
Real Time With...HKPCA & IPC Show 2016: IPC Hand Soldering World Championship in China
IPC President John Mitchell speaks with Editor Stephen Las Marias about the highlights of this year’s IPC Hand Soldering World Championship, which was held in China for the first time. He discusses how IPC has managed to keep the event so popular and successful for such a long time.
The Hunt for the Best Pre-Owned SMT Equipment Supplier
There are many SMT equipment resellers out there, some with many years of experience and others that are merely intermediaries between a company that’s trying to sell their surplus equipment and you. With that in mind, think of what you can afford not only in terms of the cost of equipment, but also regarding installation, training and support.
How to Create the Perfect SMT Reflow Oven Profile
While EMS providers will have their own preference when it comes to machine type and brand, broadly speaking, the process steps they go through to produce PCBAs are the same. However, one step that can make all of the difference when it comes to quality and consistency is reflow. This article details how EMS companies can go about creating the perfect SMT reflow oven profile.
Sales and Marketing in a Digital Transformation Reality
While many of the common sales and marketing best practices apply to the PCB assembly industry, however, deep manufacturing and electronics design expertise is required to truly drive customer interactions from one-off transactions into long and sustaining relationships as the industry goes through rapid change such as the larger involvement of a younger generation in the workforce, and the move to digital transformation and smart manufacturing.
Meeting Current and Future Requirements of the Automotive Industry
Phil Kinner, technical director of Electrolube's Coatings Division, speaks with I-Connect007's Pete Starkey about the role of conformal coatings in various applications of the automotive industry. He talks about thermal shock testing, and provides updates on their collaboration with the National Physical Lab on condensation testing.
EMS Industry Sales and Marketing: Why Strategies Vary Widely
In this article, Susan Mucha of Powell-Mucha Consulting explains why sales and marketing strategies vary widely in the EMS industry. She provides a case study of four EMS firms and their approach to the sales and marketing process.
The Business of Doing Good
This is the time of year when many people look back to what they have done so far to get a handle on goals for the coming year. Businesses also engage in the same year-end assessment, this time with greater focus on the things they have been doing right and how to improve on aspects that need more work.
Disaster Recovery Planning: What to Look for in an EMS Partner
While you're unlikely to encounter a catastrophic event in your electronics manufacturing outsourcing venture, it's nevertheless prudent to ensure that you work with an EMS partner who has the capabilities to deal with such a scenario if it should occur. So what should you look for in an EMS provider's disaster recovery policy, to ensure you're covered?
Boundary Scan Meets Functional Test
This article discusses some fundamental aspects of the combination of boundary scan and functional test, as well as new technological solutions for embedded functional tests and their practical implementation.
Rework and Repair Standard Getting Updated
The IPC-7711/21 Rework of Electronic Assemblies/Repair and Modification of Printed Boards and Electronic Assemblies is being “upreved” from version “B” to version “C” and will soon be released to the industry. This article talks about a couple of notable changes that strengthened, modernized and brought together changes from the previous “B” version, which was approved in 2007.
How to Avoid a PCB Supply Shortage During Chinese New Year
The post-Christmas blues are bad enough, but getting caught out by a PCB supply shortage due to the week-long Chinese New Year is likely to cause both you and your EMS partner significant pain. By assessing both your current and future demand, and then working closely with your PCB suppliers, EMS provider and end users, you can take a number of steps to minimize the risk to your business.
Digi ConnectCore 6UL Creates a Big Buzz at electronica
Guy Volckaerts, director for EMEA embedded sales at Digi, speaks with I-Connect007's Judy Warner about Digi’s star-of-the-show at the recent electronica event in Germany—the Digi ConnectCore 6UL—a quick, simple, feature-rich, yet very flexible system-on-module solution for OEMS and developers.
Editor's Note: Selling Success in the PCBA Industry
I am neither a salesperson nor a marketing person, but over the course of my editorial work, and through speaking to technology and systems providers in the electronics manufacturing industry, I have learned a few things when it comes to sales and marketing, namely, the importance of collaboration, positive relationships, and technical knowledge. For example, sales and marketing teams must work together to make sure deals get closed and contracts are awarded.
LA/Orange County SMTA Tech Expo a Success
On November 3, I had the pleasure of attending the LA/OC SMTA Tech Expo in Long Beach, California, and meet with chapter President Kathy Palumbo and Vice President Scott Penin, to learn more about this annual event and the chapter’s ongoing activities.
Real Time with...HKPCA & IPC Show 2016 Slideshow - Day 2
The 2016 IPC Hand Soldering World Championship was held concurrently for the first time at the International Printed Circuit & APEX South China Fair (HKPCA and IPC Show 2016) in Shenzhen, China. View the slideshow here.
My Product is Too Large and Complex to Outsource to an EMS Provider
A number of projects that struggle to get off the ground over concerns relating to size, shape or complexity can easily be outsourced – providing the project is approached in the right way. This article explains how.
Tin Whisker Mitigation Methodologies Report from SMART Group, Part 2
Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In the second part of this two-part article series, Editor Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.
Solder Voiding, Autonomous Autos, and Statistics—So Much to Learn from Dr. Ron
While at the 2016 SMTA International conference and show, I had the lucky opportunity to talk with Indium Corporation’s Dr. Ron Lasky. He gave a great synopsis of the extensive testing done by Indium Corporation’s Chris Nash on solder voids, outlined in a paper co-authored by the two, which was being presented by Ron at the conference.
SMTA Tech Expo Panel Session: It Takes a Village to Discuss Proper Cleaning Solutions
An expert in cleaning processes, Barbara Kanegsberg is known as “The Cleaning Lady.” She moderated the technical session “Ask the Experts: Meeting the Challenges of Effective Cleaning, Defluxing in Southern California.” Here Barbara discusses the myriad of challenges regarding cleaning PCBs (particularly in heavily regulated California) and what transpired during the open forum technical session.
HKPCA & IPC Bring Hand-Soldering Competition World Championships to China
Helen Guo, member services director at IPC Greater China, discusses with I-Connect007's Edy Yu IPC’s activities and initiatives in China. She also discusses the upcoming International Printed Circuit and APEX South China Fair 2016, which will feature the hand-soldering competition world championship for the first time in China.
Tin Whisker Mitigation Methodologies: Report from SMART Group, Part 1
Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In this article, Editor Pete Starkey reviews a recent seminar by the SMART Group to discuss tin whisker mitigation methodologies and strategies.
3 Reasons Why Outsourcing to an EMS Provider Can Go Wrong
A true outsourcing partnership should deliver benefits to both the OEM and the EMS provider. However, there are always risks, and sometimes outsourcing can go wrong. This article highlights three reasons why the OEM/EMS provider partnership might turn sour.
Leadership in Your Company: Something to Worry About?
Leadership is an ingredient that most feel is important, even though many find it is hard to define. Some say that you will know good leadership when you see it. In this article, Tom Borkes of The Jefferson Project discusses the role of leadership, and how it can be taught in the academia.
The Fine Art of Providing a Single Source for Fab, Assembly
Jay Rupani, president of Precision Technologies, speaks with I-Connect007's Patty Goldman about what exactly his company does, what differentiates them and why. He also talks about why having a single source for bare board manufacturing and assembly saves customers time, money and much angst.
KIC Shows Solutions to Voiding Problems via Optimized Reflow Profiling
At the recent SMTAI event, MB (Marybeth) Allen of KIC speaks with I-Connect007's Patty Goldman about her company, and discusses some of the details of her presentation titled "Optimized Reflow Profiling to Minimize Voiding".
The Hidden Costs when Outsourcing your Electronics Manufacturing
There's a lot of truth in the saying, "You get what you pay for" – so it's important not to skimp on price when selecting a partner. Equally, you need to remain competitive. So, when you're comparing quotes from EMS suppliers, how do you find the right fit for you? This article tells you how.
An EMS with a Nimble Global Footprint Makes a Big Splash at electronica
At the recent electronica trade show in Munich, Alwyn Rea, director of business development for non-automotive products at ALL CIRCUITS, a French-based EMS company, speaks with I-Connect007's Judy Warner about his company, their capabilities, and what makes them different from their competitors.
Living Up to Their Name at Alpha Assembly Solutions
At SMTAI in October, I-Connect007's Judy Warner spent some quality time with Alpha Assembly Solutions' Jason Fullerton, to discuss Alpha's innovative new products. Fullerton also discussed a paper he was presenting, which compares two lead-free, silver-free alloys in a selective soldering application.
The Impact of Vias on PCB Assembly
Via technology has been one of the solutions to address the miniaturization and component density challenges in current electronic assemblies. However, vias are not without their own set of challenges. As per our recent survey, these include impedance matching, routing, placement of vias, minimum size limitations, aspect ratio, and the limitations for the PCB manufacturer.
Why an SLA is Central to Meeting Customer Demand
How do EMS providers overcome supply chain challenges in order to successfully meet the challenge of consistently delivering product to fluctuating customer demand? Through service level agreements (SLAs). This article explains why.
To Bake or Not to Bake: Examining the Impact of Waiving PCB Pre-Baking Prior to Assembly
Moisture plays a critical role in lead-free PCB assembly—and one process that aims to drive moisture out of the PCB is baking. In this article, Yash Sutariya explains the results of his study on the impact of waiving PCB pre-baking prior to assembly. His study includes via integrity, via life impact, via failure, and overall reliability failures.
Electrolube on Addressing Thermal Management Issues in LEDs
At the recent electronica 2016 trade show in Munich, Germany, Jade Bridges, global technical support manager of Electrolube, speaks with I-Connect007’s Pete Starkey about how they are helping customers address the thermal management challenges in electronics assemblies, including LEDs and LED assemblies.
Electrolube’s Alistair Little on Thermal Management in Automotive Electronics
At electronica 2016, Alistair Little, technical director of Electrolube’s Resins Division, sits down with Editor Pete Starkey to discuss thermal management challenges in the automotive industry, and how their resin solutions are helping customers address those high-temperature requirements.
Chintan Sutaria: CalcuQuote Aims to Disrupt EMS Quoting Status Quo
Chintan Sutaria of CalcuQuote speaks with I-Connect007's Judy Warner about what inspired him to develop CalcuQuote. He also explains how CalcuQuote supports capturing customers' requirements to coming up with labor and material costs, allocating overhead, markups, and following up with the customer.
Why Takt Time is Important, and How to Calculate It
A common misconception is that takt time relates to the overall build time, i.e., the number of man-hours put in to building a product. It doesn't; it relates to the time span required to build a product from start to finish to ensure the continual flow of finished products needed to satisfy customer demand.
How to Improve PCB Reliability
Component failure rates have steadily declined over the years to the point where non-component failure sources have become the dominant cause of failures for a PCB. If the reliability of the components is becoming a non-issue, then the only way to improve electronics further—for this article, automotive electronics—is to look at the non-component aspects of the electronics, and a significant one is the PCB.
A Long-term Career Prospect
The next millennial in this series is Alex Johnson, an associate engineer at Saline Lectronics and who has been with the company for over two years. Even though Alex received a lot of negative information about manufacturing throughout his lifetime, his work experience in engineering has directly challenged those preconceived notions.
The Taken-for-granted Via
Vias are so simple, yet they can be so complex at the same time. Designed properly, they complete a circuit. However, a poorly designed via can be a reliability nightmare. The bottom line is that, in many ways, they are the unsung hero to a circuit board, much like an offensive line is to a football team.
Increasing Reliability through Predictive Analysis
At SMTA International 2016, Joe Russeau of Precision Analytical Laboratory discusses with I-Connect007's Patty Goldman the paper he was presented, which was co-authored by Mark Northrup and Tim Estes. The paper presents early data comparing the results of two different analytical test methods to determine how well they correlate with each other as predictors of PC board cleanliness and reliability.
Is Your Manufacturing Facility Now the Weak Link?
If your manufacturing facility is the weakest link in your chain, all of the hard work put in beforehand—design, marketing, sales, purchasing—will have been wasted. This article looks at three signs your manufacturing facility could be dragging the rest of your company down, and highlights how outsourcing to an EMS provider can help.
Achieving the Smart Factory Vision
James Liu, director of Standardization and Electronics Manufacturing at the Smart Factory Institute of the China Science and Technology Automation Alliance, talks about helping small- and medium-sized companies transform their production into smart factories. He explains the challenges these companies face, and the need for a free, open interface to connect disparate electronics manufacturing equipment and systems on the factory floor.
Leadership Toward Greater Meaning
In the last decade, sustainability has moved up the priority agenda of business leaders tasked to shape their companies' goals. Strategies are now being set up to provide not only profitability and financial growth but, more importantly, ensure that the people that are involved, the communities that these companies serve, and the products that they build are actually entwined in making the world a better place.
Is Your Sales Growth Outstripping Your Current Manufacturing Capacity?
Picture the scene: you are an OEM enjoying healthy sales growth—business is booming as you win new customers and sell more to the ones you already have. However, there's just one problem – you don’t have the manufacturing capacity to accommodate your growth, whether because your factory is too small, you are lacking crucial equipment, or you simply don't have enough staff. Here's what you can do.
The Make-up of a Great Leader
Knoll Evangelista EMS Components Assembly Inc. speaks about leadership, motivation, and how great leaders navigate the challenges to bring their companies to success. He also shares his insights regarding best strategies in managing millennials.
Inspiring Others: The Key to Leadership
In an interview with SMT Magazine, Jean-Marc Peallat, vice president of global sales at Vi Technology, shares his thoughts on the role of a leader and how it differs from that of a manager. He also discusses how management has evolved over the past decade, and why inspiration is the key to leadership.
Recruiting and Maintaining a High-Quality Manufacturing Workforce
In almost all industries, the people are companies' biggest competitive advantage. This article looks at strategies to develop an effective way to recruit and retain high-quality team members in labor markets where experienced manufacturing talent is in short supply.
Industry 4.0 and the Circular Economy
There has been much written recently about Industry 4.0, and rightly so as it's a huge and far-reaching concept that will have an enormous impact on our design and manufacturing industries in the coming years. Even so, Industry 4.0 is just part of an idea that is much, much bigger; something known as the "circular economy".
Building Bridges with Cross-Cultural Teams
Understanding behavior patterns driven by the cultures of team members, having discussions about differences and similarities, and creating an environment where people are comfortable discussing their concerns can go a long way to eliminating cultural conflict and building stronger teams.
Do the High-Paid Managers in Your Organization Add Value?
The widening gap between industry need and academic preparation has an adverse effect on the ability of a company to compete in the global manufacturing marketplace—and all competitive roads in any capitalist free market business ultimately lead to a cost versus contribution analysis. This article discuss another important cost driver—the cost of management and leadership, what a company gets for that money.
New Column: Millennials in Manufacturing
New columnist Davina McDonnell will be writing on the challenges millennials face in the workplace, and the unique dynamic between millennials and the industry veterans who manage them.
Defining a Leader
One could define a leader as an individual leading a group of individuals towards a clearly defined goal. This article highlights some of the key leadership principles, such as self-evaluation, skills, knowing your employees, and setting standards by leading by example, that would help steer a company in this industry to success.
Koh Young Talks AOI Landscape and Trends
During the recent NEPCON South China tradeshow in Shenzhen, Thomas Lau, sales manager for Southeast Asia at Koh Young Technology Inc., speaks with I-Connect007's Stephen Las Marias about the challenges and developments happening in the AOI sector.
How to Successfully Manage the OEM/CEM Partnership
A successful outsourcing initiative is built on trust and communication and both partners—the original equipment manufacturer (OEM) and a contract electronics manufacturer (CEM)—need to be clear on what their own roles are, in order to realize the innumerable benefits.
Choosing an EMS Partner
So many times we hear that an EMS company and their potential new customer want to have a partnership where each side can have a very open dialogue of what is going well and what needs improvement. At the end of these discussions, both sides typically leave feeling warm and fuzzy, and ready to hold hands into the sunset. Then, the rubber hits the road and you start dealing with the real world.
How to Evaluate a Used Machine
There are some cases where you can get a good deal on used SMT assembly equipment and save some money over a new machine. This article will help guide you in your search and give you some tips to avoid getting a raw deal or actually spending more than new by the time you get that bargain acquisition in good working order.
Leadership Evolution in a Changing Marketplace
To continue to grow and remain competitive amid broad systemic change such as the growing number of millennials in the workplace, the globalization of both customers and competitors, increased uncertainty in the marketplace, and increased demands for flexibility, leaders must continue to evolve their own leadership skills and approaches, and make better use of the talent they hire.
Real Time with…SMTAI: Dimation's Same-Day EMS Service
Edward Knutson, president and founder of EMS firm Dimation, speaks with I-Connect007’s Judy Warner about his company’s quick-turn EMS service: from a turnaround time of one to two days. In fact, if customers bring in their parts and board, they can even expect their product within the same day.
What Makes a Great Leader?
Leadership encompasses the ability of an individual to lead or guide other individuals, teams, or entire organizations in the accomplishment of common goals. In many industries, great leadership is required now more than ever as companies face a myriad of challenges such as globalization, uncertainties in global markets, and increased demand for flexibility.
Real Time with... SMTAI: Mentor and Kulicke and Soffa Discuss Partnership
Michael Ford of Mentor Graphics and Tom Kramer of Kulicke and Soffa speak with I-Connect007’s Andy Shaughnessy about their partnership and synergy, and how they enable customers to become flexible and productive even with high-mix operations.
Smart for Smart’s Sake, Part 1
In his previous article, Michael Ford wrote about the various historical methods of collecting data from shop-floor processes, and how it compares to the fully normalized approach of OML, where data from any machine operation can be expressed in a single interoperable language. This article discusses the next layer of activity—how the data collected is to be used for asset utilization and productivity.
Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies
The C-SAM (C-mode scanning acoustic microscopy) is the preferred method for finding "air gaps" such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment.
Is PCB Assembly Really the Best Entry Point into Outsourcing?
By outsourcing your PCB assembly, you will free up more time and resources to direct your focus elsewhere. However, the PCBA is just one component within your final product; you still have a lot of work to do once your EMS partner has delivered the completed boards to you.
Real Time with… SMTAI: Making Your Shop Floor More Intelligent
Mitch DeCaire, channel sales manager at Cogiscan, speaks with I-Connect007’s Andy Shaughnessy about how real-time data collection from the factory floor can help customers improve their quality and overall productivity.
Real Time with… SMTAI: Merger Puts Libra Industries in Driver's Seat
W. Scott Fillebrown, CTO of EMS firm Libra Industries, talks with I-Connect007’s Andy Shaughnessy about Libra’s acquisition of ACD last year, their migration to common platforms and systems, and how their latest equipment installations have helped improved efficiency and throughput in their manufacturing lines.
Real Time with... SMTAI: Gary Tanel on His Founder's Award, SMTA Benefits
Gary Tanel, vice president of business development at McDonald Technologies and president of the SMTA Dallas Chapter, speaks with I-Connect007’s Andy Shaughnessy about his SMTA Founder's Award—the highest honor given by SMTA.
10 Meaningless Statistics EMS Providers List on their Websites
In an attempt to stand out from other EMS providers, we include a range of statistics on our websites. We assume OEMs find these helpful and use them to make decisions on whether or not we could be the right partner to outsource to. But are they really the key important statistics to feature?
Real Time with... SMTAI: Mirtec’s Brian D’Amico Discusses Benefits of 3D Inspection Technologies
Brian D'Amico, president of Mirtec, discusses with I-Connect007’s Andy Shaughnessy why more and more manufacturers are adopting 3D inspection technologies, such as 3D AOI and 3D SPI systems. He also mentions the increasing use of very small components—such as the 0201s and 01005s—and the advent of the 03015s.
Real Time with… SMTAI: Alpha's Strategies to Ensure Reliability of Assemblies
I-Connect007’s Judy Warner and Robert Wallace, regional marketing manager and channel partner manager for the Americas for Alpha Assembly Solutions, discuss how Alpha helps ensure reliability of their customers’ assemblies by providing soldering material set combinations that had been fully tested together for the J-STD-004B.
Real Time with… SMTAI: Metcal Updates Scavenging with the Scarab
Paul Wood, applications manager at Metcal, discusses with I-Connect007’s Andy Shaughnessy how their standalone, contactless Scarab site cleaning system is helping manufacturers optimize their pad cleaning process.
Real Time with... SMTAI: AIM’s Tim O'Neill on Soldering Challenges and Innovation
Tim O’Neill, technical marketing manager for AIM Solder, speaks with I-Connect007’s Andy Shaughnessy about the biggest problems related to solder paste printing in a typical manufacturing process—and how their M8 no-clean solder paste is helping address these issues.
Real Time with... SMTAI: KYZEN Pushes Cleaning Data to the Cloud
At the recent SMTA International exhibition, Tom Forsythe, executive vice president of Kyzen, discusses with I-Connect007’s Andy Shaughnessy their latest system that helps customers have a better handle on their cleaning process.
Saline Lectronics Invests in the Millennial Generation
You're heard all the knocks against millennials: they're flaky job-hoppers and they're tough to motivate. But Saline Lectronics has a larger presence of these younger employees, and they find quite a few advantages to hiring staff who are far from retirement age. Saline's Jason Sciberra explains how he manages and motivates these young people.
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow – Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. This article details a round robin study that has been performed by IPC Task group 8-81f, to guide high-reliability end-users on the applicability and limitations of this mitigation strategy.
IPC Certification Program's 'Space Hardware Addendums' Training and Certification
In this article, Sharon Montana-Beard of Blackfox discusses the IPC Certification Program's Space Hardware Addendums training and certification, the topics covered in the training course, and the benefits of the program.
Ionics EMS Talks Industry 4.0, Mil/Aero Opportunities, and Supply Chain
In an interview with SMT Magazine, Dr. Jay Sabido, president and COO of Ionics EMS Inc., discusses a wide range of topics, including Industry 4.0, automation, and the challenges in the military and aerospace industry, including lead-free, counterfeit components, and traceability.
IPC-1782 Standard for Traceability Supporting Counterfeit Components
Traceability has grown from being a specialized need for certain safety critical segments of the industry, to now being a recognized value-add tool for the industry as a whole. This article discusses the IPC-1782 project, which aims to create a single flexible data structure that can be adopted for all levels of traceability that are required across the industry.
Recycling Substrates and Components in Mil/Aero Assemblies: Secure Metals Recovery
In this article, Mitch Holtzer of Alpha Assembly Solutions writes about reworking defective military and aerospace electronics assemblies, and recovering the value of the substrate and components without compromising the top secret design of the circuit.
The Theory Behind Tin Whisker Phenomena, Part 4
In this fourth installment of the series on the theory behind tin whiskers, Dr. Jennie S. Hwang continues on her discussion of the likely key processes engaged in tin whisker growth—lattice vs. grain boundary diffusion, and reaction and dynamic of intermetallic compounds.
Asteelflash on Mil/Aero Challenges, ITAR, and Opportunities
In an interview with SMT Magazine, Albert Yanez, corporate executive VP and president of Asteelflash, Americas, discusses the challenges in the military and aerospace industries, ITAR compliance, and the opportunities in these sectors.
The Blackfox Advanced Manufacturing Program for Military Veterans
You might be wondering why you should hire a military veteran, especially if your company has nothing to do with the military. But hiring veterans can bring a wealth of benefits, and this article highlights them. It also focuses on the Blackfox Veteran’s Training Program, the first program of its kind to provide veterans with little to no industry experience with the skills to grow their careers in the electronic assembly industry.
How to Specify a Custom Machine
Let’s say you have an unusual product configuration, a unique space requirement, an unorthodox handling system, or an application totally unrelated to the PCB or SMT assembly business, and you can’t find a standard machine provider that can handle your requirements. What then? This article highlights key points to consider when going the custom machine way for your project.
Is Your Electronics Manufacturing Factory 'Smart'?
Despite the amount of content being produced around big data, Industry 4.0, digital manufacturing, mass customization and various other subjects, a large number of electronics manufacturing companies still don't fully understand this question. This article looks to provide guidance on how you can assess your manufacturing facility without investing huge amounts of time and money upfront.
Being More than a Manufacturer’s Rep
Matt Bonweg, process support specialist at manufacturers' rep firm Murray Percival Company, speaks with I-Connect007's Patty Goldman during the recent SMTA Ohio Expo about the company's history and philosophy, as well as their strategies for success in this industry.
Naprotek: Building a Successful EMS in Silicon Valley with a Woman's Touch
I-Connect007's Judy Warner recently visited Naprotek Inc., an EMS provider in the heart of Silicon Valley. She speaks with CEO Najat Badriyeh and two of her team members – VP of Marketing Liz Davidson, and Director of Business Development Mike Brown – about their company and their plans for the future.
Silicon Valley SMTA Chapter President Kevin McClay on Evolution and Current Status of SMTA
Kevin McClay, president of Silicon Valley SMTA Chapter, speaks with I-Connect007’s Judy Warner on the activities of the SMTA in the Valley, and the challenge of attracting young talent to join the manufacturing engineering industry.
Digital X-Ray—For More Than Inspection
At the recent SMTA Ohio Expo, Sheri Martin, sales manager at YXLON, spoke with I-Connect007's Patty Goldman about her company, their digital X-ray system, and the value of joining such trade events, and the benefits of using X-ray when it comes to failure analysis.
Real Time with NEPCON South China: Mentor Graphics Discusses Control on the Shop Floor
Ofer Lavi Ben David, director of shop floor manufacturing solutions at Mentor Graphics Valor Division, talks with I-Connect007’s Stephen Las Marias about how the smart factory should look, their Open Manufacturing Language, and their solution to provide end-to-end visibility and control in the shop floor.
Geek-A-Palooza: 'Who Says Doing Business Can't Be Fun?'
Geek-a-Palooza, now in its fourth year, is the new kind of business event that combines networking with fun. With a relaxed environment approach, the event is catching on and continues to grow. Dan Beaulieu catches up with Tara Dunn about the upcoming Boston and Minneapolis events…and beyond.
SMTA Reaching Out to Locals and Students
Tanya Martin, executive director of the SMTA, speaks with I-Connect007's Patty Goldman at the recent SMTA-Ohio expo about local one-day expos that are spread across the country throughout the year, and the increasing interest in student chapters on campuses.
Real Time with NEPCON South China: BTU Talks Voiding in Automotive Electronics, Industry 4.0 Strategies
At NEPCON South China 2016, Bob Bouchard of BTU International Inc. discusses with I-Connect007’s Stephen Las Marias the challenges and opportunities in the China market, how BTU is helping address voiding issues in automotive electronics assemblies, and their Industry 4.0 strategies.
Real Time with NEPCON South China: WKK on Automation, China Outlook, Challenges and Opportunities
Victor J.S. Chang, director and general manager of WKK Distribution Ltd, discusses with I-Connect007's Stephen Las Marias the increasing automation trend in the region; the efforts of the Chinese government to support the growth of advanced manufacturing; and the latest initiatives at WKK.
Real Time with NEPCON South China: Rehm Thermal Systems Highlights Industry 4.0 Benefits
In Shenzhen, China, Ralf Wagenfuehr, plant manager for Rehm Thermal Systems, speaks with I-Connect007’s Stephen Las Marias about Industry 4.0 and the benefits of this automation trend.
Real Time with NEPCON South China: P. Kay Metal Discusses New Markets for MS2
James Goyne, the newly appointed global business development director at P. Kay Metal Inc., speaks with I-Connect007's Stephen Las Marias about what he aims to achieve in his new role, as well as the new markets and opportunities for their MS2 solder dross eliminator.
The Authors of the Printed Circuits Handbook 'Speak'
The seventh edition of the Printed Circuits Handbook was published this spring, which was also the 50th anniversary of the first edition. For this issue—“Voices”—we asked the many authors of the handbook for their thoughts—their voices. We asked a few questions to get them started; though not everyone spoke strictly about the handbook, we found their comments interesting and thought-provoking, and we hope you do as well.
Will The “Internet of Manufacturing” Really Impact Business?
Supporting legacy, new, and future automated processes, as well as the vast number of manual processes in use today, is the key to being able to successfully introduce the Internet of Manufacturing into SMT production.
I-Connect Survey: A Look at the Mil/Aero Industry
I-Connect007 recently conducted a survey on the military/defense and aerospace markets. Respondents were asked about the greatest challenges when it comes to PCB design, fabrication, and assembly; their customers’ demands; whether lead-free components are still an issue; and compliance challenges.
4 Benefits of Industrial Automation in Electronics Manufacturing
In a nutshell, industrial automation is a step beyond mechanization; it is about using control systems and technology to replace human physical and mental labor in the manufacturing and engineering sector. This article talks about four of the resulting benefits of automation for electronics manufacturers.
Standardizing Platforms from Characterization to Production
Over the past decade, the intense focus to reduce the cost of testing has produced a significant shift from using turnkey automated test equipment to building in-house and cost-optimized testers based on off-the-shelf instrumentation. This shift to a custom tester approach has been a large factor in the success of modular instrumentation platforms in the electronics manufacturing industry. This article explains why.
Case Study: Flex Smart Factory at Fuyong
This paper discusses Flex's experience with their current project called Smart Factory, which is being implemented at their Fuyong facility in Shenzhen, China. It also highlights some of the benefits they have achieved, including traceability, improved productivity and quality, and minimized defects through process predictability.
The Industry Speaks
In the latest issue of SMT Magazine, we take a pause from covering the latest technology trends, challenges, and solutions in the electronics manufacturing and assembly industry. Instead, we are focusing on our readers—to give a voice to their thoughts on the industry, companies, jobs, interests, and even pain points when it comes to their respective specialties.
Integrated Manufacturing Solutions: an EMS, ODM, CM, and OEM!
Robbin Thompson, VP Business Development at San Diego-based contract manufacturer Integrated Manufacturing Solutions (IMS), speaks with I-Connect007's Barry Matties and Judy Warner about her company's expansion, production capabilities and product lineup, as well as the culture at IMS.
Local SMTA Expos Are Where It’s Happening!
At the recent SMTA chapter expos, Greg Vance with Rockwell Automation and Brett Crane with Bird Electronic Corporation speak with I-Connect007's Patty Goldman about the event, and the trends happening in the electronics manufacturing industry.
The Benefits of 3D Printing within Contract Electronics Manufacturing
The buzz around 3D printing, or additive manufacturing as it also known, continues to grow day-by-day, and it is regularly hailed as a revolutionary "new" process. This article discusses the basics of 3D printing and the different types of printing processes that exist, along with the benefits these bring to contract electronics manufacturers and the customers they serve.
IMS and STEM: Building a Stronger Future
At the recent IEEE International Microwave Symposium (IMS2016) show held in San Francisco, California, I-Connect007's Barry Matties met with IEEE MTT Education Committee STEM Lead Steven Lardizabal to learn more about the show’s STEM outreach, how they inspire students to join the technology field, and the success of the educational program.
Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with SAT
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. This article reports a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.
Event Review: 7th Electronic Materials and Processes for Space Workshop
This year's Electronic Materials and Processes for Space Workshop discussed a wide range of technology issues and developments when it comes to PCB fabrication and assembly for space applications. From addressing reliability issues to dealing with cracks that may form during thermal cycling, to REACH regulations and their impact on space hardware, and tin whisker growths. Barrie Dunn provides the highlights.
3 Common Fears About Outsourcing Your Outbound Logistics
If you are still responsible for shipping finished product to your end users, you may be facing difficulties that are distracting you from your core activities. This article explains how you can overcome the common fears about outsourcing your outbound logistics to an EMS provider.
Moving Beyond Paideia: Learning for Earning
The complexities of our technological world and global marketplace now demand the development of specific, saleable skills as part of the student-customer's educational process--and that the template for teaching these skills must be based in the real world. Tom Borkes explains why in this article.
Investing in the Future Voices of our Industries
FIRST (For Inspiration and Recognition of Science and Technology) is a massive global initiative, aimed at getting kids more interested in STEM subjects through a variety of fun and interactive experiences. At a recent Maker Faire, Barry Matties spoke with FIRST's Jill Wilker and Ken Johnson about their organization's mission and vision.
Bumping of QFNs/LGAs and Other Leadless Devices for More Consistent Rework
Among the greatest challenges leadless devices present are the solder voiding primarily on the ground plane, the inability to clean underneath the devices post rework, and the difficulty in getting similar standoff heights on both the IO and center ground. This article talks about the type of rework methods available to address these issues.
Selecting a Selective Soldering System, Part 5
For the conclusion of his series on selective soldering discussion, Robert Voigt does a quick wrap-up to remind potential buyers about some important considerations that affect the purchase decisions they make.
How to Prevent Solder Bridges During Printed Circuit Board Assembly
Solder bridges occur when solder unintentionally connects one electronic component lead to another. Thankfully, a large number of solder bridges can be easily prevented. And while preventive measures may cost you a small amount of additional time and money, the long term payback can be significant.
Milwaukee Electronics: Screaming-Fast in Pursuit of 'Perfect Products'
Jered Stoehr, VP of sales and marketing at Milwaukee Electronics, discusses with I-Connect007's Judy Warner the innovative ways their company is meeting the needs of today's OEMs. He also talks about the challenges and opportunities they are seeing in their markets.
The STEM Trap
Post-secondary schools have not been responsive to the changing landscape of the modern electronic product assembly operation—they really can’t, considering the lack of real-world experience of most of the faculty. In this article, Tom Borkes explains why.
Condensation Testing—A New Approach
While the characterization of coating performance under high humidity conditions is detailed in well accepted IPC and IEC standards, the performance and testing under condensing conditions is not so well developed. This article talks about a new approach that has been developed where the test board is mounted on a substrate whose temperature can be independently controlled without changing the ambient condition.
Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements
This study will compare the results from testing two solder pastes using the IPC-J-STD-004B IPC TM-650 188.8.131.52 surface insulation resistance test and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth
Manufacturers are faced with steadily increasing miniaturization and higher packing density in PCB assemblies. Packing densities, in particular, repeatedly create challenges in terms of testability, especially when high components such as connectors are fitted in close proximity to other components. This article looks at different handling and testing requirements for connectors.
Why Flexibility is Crucial to the Success of Your Outbound Logistics
When it comes to outbound logistics, the ability to adapt in order to reach new markets and meet ever-changing customer demands, is vital. This article explores how partnering with an electronics manufacturing services (EMS) provider will help to ensure you are fully equipped for change in a fast-paced global environment.
Material Effects of Laser Energy When Processing Circuit Board Substrates During Depaneling
Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Understanding the effects of the laser energy to the substrate material properly is essential in order to take advantage of the technology without creating unintended side effects.
Industry 4.0: Making the First Move
Many companies now have active Industry 4.0, Internet of Manufacturing, or smart factory projects. In each case, different approaches were taken that appeared to best fit the project requirements and that would deliver the intended benefits versus the cost and effort investment needed. However, there is no best solution. This article explains why.
Package-on-Package Warpage Characteristics and Requirements
iNEMI organized the Warpage Characteristics of Organic Packages Project to identify primary factors that can contribute to the warpage performance of selected components during typical SMT processes, to better understand package warpage characteristics across different package types and attributes. This article focuses on the work related to package-on-package.
EPC’s Michael de Rooij Discusses Strategic Partnership with Wurth Electronik
Michael de Rooij, PhD, of Efficient Power Conversion Corp. (EPC) talks to I-Connect007 guest editor Kim Sauer about their strategic alliance with Wurth Electronik, how their cooperation works, and how the technology solution they are co-developing can address the wireless power challenge as a whole.
Understanding How EMS Companies View Capital Investment Decisions
One of the great benefits of outsourcing your manufacturing is that it can largely remove the need to continually invest in expensive capital equipment. But when selecting an EMS partner, it is important to take a realistic view of their equipment list. This article explains why.
A New Dispensing Solder Paste for Laser Soldering Technology
A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering BGA spheres on circuit boards with minimal voiding and no splash or solder balling issues.
How to Overcome Medical Electronics Manufacturing Challenges
There are a lot of things to consider when choosing a medical EMS provider to work with and it is worth taking time to make sure the partner fits your needs. To help you make comparisons between suppliers, this article lists a set of questions to ask to help ensure that the manufacturer you work with has the right experience and expertise for you.
The Pasternack Story
John Farley, director of marketing for Pasternack Enterprises, speaks with I-Connect007's Judy Warner during the recent International Microwave Symposium event about their experience at this year's show. John also discusses the multiple layers of Pasternack's RF products and services and the unique way they do business.
Addressing New Testing & Inspection Challenges
NK Chari, marketing director for manufacturing technologies at the Electronic Industrial Solutions Group of Keysight Technologies, talked about the challenges in PCBA testing and inspection, tougher requirements for testing, and the need for functional testing. He also mentioned some best practices to consider to improve the PCBA testing and inspection process.
Case Study: Achieving Near-Perfect Reads of Data Matrix Codes in PCB Assemblies
The range of Data Matrix marking techniques and PCB materials means that the appearance of marks in PCB assemblies can vary dramatically from one situation to the next. In this case study, each PCB needs to be read at the time of solder inspection so the inspection results can be stored in a database. An integrated solution was developed to reduce the downtime required for opening the inspection machine and manually entering the labels of the PCB assemblies.
I-Connect Survey: Automation or Reducing Process Steps?
In our recent survey, we asked what is more important: automating a process or eliminating process steps. Interestingly, the results are 50-50: half of our respondents say automating a process is more important, while the remaining 50 percent consider eliminating a process step a key strategy.
ITRI’s Wang Talks Future of Soldering and Paste Printing
In an interview with SMT Magazine, Wang Chao, technology manager at UK-based ITRI Ltd, discusses the biggest challenges in solder paste printing, how the solder paste material impacts the process, and the future for soldering and paste printing.
5 Myths About Electronics Manufacturing Outsourcing
OEMs have been outsourcing their electronics manufacturing and test for decades, yet a number of myths relating to outsourcing still remain today. In this article, Neil Sharp tackles some of these myths head on so that anyone considering outsourcing to an EMS provider can base their decision on facts and not fiction.
Selecting a Selective Soldering System, Part 4
In the previous three chapters on selective soldering, Robert Voigt covered the different applications well-suited to this technology, the various types of fluxing and soldering methods available, and nitrogen inerting. In this chapter, he discusses programming software, and how you can figure out the best sequence to optimize production speed.
An Integrated PCB Producer’s Approach to the Market
NCAB Group is one of the biggest PCB suppliers in the world. Barry Matties and Stephen Las Marias recently met with Andy Liu of NCAB to discuss an integrated producer’s approach to the market, new design tools, the current state of the Chinese market, and the future of 3D printed electronics.
The Fourth Industrial Revolution (Industry 4.0): Intelligent Manufacturing
The last industrial revolution was driven by striking advances in electronics and information technology having achieved enormous economic prosperity and manufacturing automation. So what is the fourth industrial revolution and what does it encompass? This article talks about the genesis of the term and the vision for Industry 4.0.
Improving Test and Inspection
In our recent survey on PCBA test and inspection challenges, respondents consider the following to be among their biggest problems: probing to narrower traces and pads; testing boards with smaller and finer features and sizes; dry solder and other solder-related issues; finding sublayer defects; dealing with flat, no-lead components; and testing cycle time. This month, we look into different PCBA test and inspection strategies that address the key challenges in today’s electronics manufacturing and assembly environment.
Conversations with STI Electronics' Dave Raby at IPC IMPACT Washington, D.C.
Dave Raby, president and CEO of EMS firm STI Electronics and an eager participant at this year’s IMPACT Washington, D.C. event, speaks with I-Connect007’s Patty Goldman about his expectations at this year’s conference.
Zentech’s Matt Turpin on IMPACT Washington, D.C.’s Benefits
At the recent IMPACT Washington, D.C. 2016 event in Capitol Hill, Matt Turpin, CEO of EMS firm Zentech discusses with I-Connect007's Patty Goldman his expectations on the event, its importance, and how, so far, it has helped the electronics manufacturing industry in the United States.
Hand Soldering: The Move Toward Automation
At the recent NEPCON event in Shanghai, JBC's Domingo Taberner discussed with I-Connect007's Barry Matties the hand soldering market in China, the move towards automation, the greatest challenges their customers have in soldering, and what to know about choosing the right temperature and tip.
A First-Timer's Perspective on IMPACT Washington, D.C. 2016
I-Connect007 editor Patty Goldman speaks with Faisal Pandit, president of Panasonic Factory Solutions Company, during the recent IMPACT Washington D.C. 2016 event. They discuss his experience as a first-time attendee, and his reasons for attending the event this year.
Solder Paste Dispensing: Breaking the Limits of Printing
In an interview with SMT Magazine, Eric Gu, application manager at Nordson Asymtek China, talks about the greatest challenges and innovations in solder paste dispensing, and factors to consider when using solder paste dispensers.
The Reliability Factor in Solder Paste Printing
In an interview with SMT Magazine, Knoll Evangelista of EMS firm EMS Components Assembly Inc. speaks about the solder paste printing challenge, what factors impact the process, and best practices to consider.
To Clean or No Clean?
The addition of a cleaning process to your manufacturing line will amount to an added 5–6 cents per board produced. Mike Konrad of Aqueous Technologies believes that is a small price to pay for the added value, testing, and reduced liability and insurance that a cleaning solution can provide; however, he admits cleaning isn’t for everyone.
Solder Paste Printing: A User’s Perspective
Integrated Micro-Electronics' Joemar Apolinario, Aurelio Bantigue, and Rodney Bebe, discuss the challenges and key considerations to make when dealing with tighter tolerances and finer pitches in line with the continuing miniaturization trend in the electronics manufacturing industry. They also talked about the impact of solder pastes in the printing process, and the criteria for their selection and qualification.
SPI Parameter Considerations for Tighter Tolerances
In an interview with SMT Magazine, Vi Technology’s Jean-Marc Peallat and Chong Choon Hee speak about the solder paste inspection challenges when it comes to tighter tolerances and finer lines and pitches in board assemblies, and the latest innovations happening in the SPI space to help customers address these issues.
IPC President John Mitchell Discusses IPC's Footprint in China
At the Capital Club in Beijing, IPC’s president John Mitchell met with I-Connect007’s Edy Yu to discuss the current activites of IPC China. Some of the topics covered included the growing China membership, training, trade shows and IPC China’s standards development effort.
Jumping Off the Bandwagon: The Production Engineering Student as Customer
Production, industrial, process, manufacturing engineering, to name a few fields of engineering study, will never be successfully taught on-line. In his latest article, Tom Borkes explains why.
Creation Technologies on IMPACT Washington, D.C. 2016
Bhawnesh Mathur, president and CEO of contract electronics manufacturer Creation Technologies, shares his thoughts with I-Connect007's Patty Goldman on the benefits of the recent IMPACT Washington D.C. event.
Solder Jet Printing: Keeping Up with the Challenges
In an interview with SMT Magazine, Thomas Bredin, area sales manager at Mycronic, discusses solder paste printing, and how the jet printers are getting up to speed with the challenges such as tighter tolerances and finer lines and pitches. He also talks about key factors to consider when selecting a solder paste printer, and what Mycronic 4.0 is all about.
RTW IPC APEX EXPO: ACE's Alan Cable Discusses Benefits of Selective Soldering, and Need for Lead Tinning
Alan Cable, president of ACE Production Technologies, talks to I-Connect007 guest editor Mark Thompson about selective soldering and how it helps electronics assemblers overcome the high cost of labor.
Selecting a Selective Soldering System, Part 3
The previous two articles on selective soldering covered the different applications well-suited to this technology, and the various types of fluxing methods available. In this article, Robert Voigt discusses the common types of soldering technologies available, as well as nitrogen inerting systems.
Pad Defined vs. Mask Defined: Which Method is Optimal?
It seems that there is no universal consensus on a seemingly simple choice used in designing electronic circuits. Should the pads on the PCB be defined by the edge of the solder mask opening (mask defined), or should the solder mask opening fall short of the circuit board interconnect (pad or non-solder mask defined)? In this article, SMT Magazine columnist Mitch Holtzer discusses which among the two methods is optimal.
Improving the Solder Paste Printing Cycle Times
At the recent NEPCON China show in Shanghai, I interviewed Adam Sim, senior sales manager at Speedline ITW EAE, about the challenges in solder stencil printing, how printing cycle times may be improved, and the key factors to consider when selecting a solder paste printing solution.
To Bake or Not to Bake (in Rework)—That is the Question
When performing rework on printed circuit boards, the issue of the moisture having to be baked out of the PCB is often debated. Whether it is localized mini-wave rework, hand-soldering or convection rework, the board, as well as neighboring components, needs to be taken into account in terms of moisture protection during the reflow cycle. This article details the baking requirements during PCB rework.
Bright Future/Bright Plan: Photostencil
Photostencil is looking at a multitude of new developments right now, not least of which is the opening of a “new from the ground up” factory that will allow them to address their customer’s greatest needs, including the growing challenge of miniaturization. Photostencil’s VP of Global Sales, Rachel Short, talks to Guest Editor Kelly Dack about the new factory, the positive outlook the company’s customers are exhibiting for 2015 and 2016, and customer reports of projected growth of 3–7%. Short also discusses the new nickel-cobalt electroform stencil, which is more durable and helps alleviate stretch.
Solder Paste Printing: Challenges and Best Practices
In an interview with SMT Magazine, Watson Tseng, General Manager of Shenmao America Inc., talks about the challenges in solder paste printing, key parameters and best practices to consider, and variables involved when it comes to selecting the appropriate solder paste for the printing process.
The Solder Paste Factor in Printing
Mitch Holtzer, Alpha Assembly Solutions’ global director of customer technical support, and expert columnist at SMT Magazine, talks about the challenges that customers face when it comes to solder paste printing, the impact of solder pastes on the printing process, and the variables involved when selecting the type of solder to use for specific applications.
3D Solder Joint Reconstruction on SMD Based on 2D Images
Solder joint inspection has been a critical issue for quality control, mainly due to their specular reflections. AOI systems have been faced with the same difficulty for solder inspection. This paper presents an algorithm for 3D solder joint reconstruction, which gives 3D analysis capability to the traditional 2D AOI equipment, practically without increasing the financial cost and with no cycle time impact, bringing 2D AOI equipment back into the game of SMT technology.
Solder Paste Exploration
From the manufacturers of solder pastes, to equipment makers, all the way to the solder paste inspection guys, and the electronics assemblers who are using their products, I talked to the supply chain to find out what’s going on in the solder paste printing process, what factors impact the process, the challenges, and the best practices to consider to be able to address those challenges and improve efficiencies and yield in the SMT line.
Flexible Circuit Component Assembly… and a Math Lesson
Flexible circuits are often sold in multiple-up panels or arrays to facilitate the assembly of SMT components. Coordination between the desires of the assembly supplier and the fabricator can have a significant effect on costs based on material/panel utilization.
The Henry Ford Division of Labor Production Model
We are all aware of what the price of assembling a product is based upon: material cost, number of labor hours needed for the product assembly and test, and labor sell rate in dollars per hour. In this article, Tom Borkes writes why the disparity in labor sell rates is still daunting.
Selecting a Selective Soldering System, Part 2
In Part 1, Robert Voigt began a discussion of selective soldering, including how it works, some pros and cons, and several fluxing and soldering options to choose from. This chapter dives a little deeper into the mechanics of fluxing systems.
What’s in a Name? ICAPE Group’s Glenn Colescott Explains
Glenn Colescott, director of ICAPE USA, speaks with I-Connect007's Patty Goldman about his company, their expansion plans, why they attend regional shows like the SMTA West Penn Chapter Expo & Tech Forum, and how they make customers get over the phobia over a trading company.
SMTA West Penn Chapter Plans Manufacturing Boot Camp in August
DRS Technologies' Bill Capen, who is also the president of the SMTA West Penn Chapter, talks with I-Connect007's Patty Goldman about their expanded Chapter Expo & Tech Forum, and their plans of doing a boot camp in August.
Soldering Experts on Hand at SMTA’s West Penn Chapter Expo & Tech Forum
At the recent SMTA West Penn Chapter Expo & Tech Forum, Marilyn Lawrence, founder and president of Conformance Technologies Inc., speaks with I-Connect007's Patty Goldman about the importance of solder training, and how far it has come through the years.
Electrolube: We Like Problems (Chinese Style)
In a follow-up interview, Ron Jakeman, group managing director of Electrolube, discusses with I-Connect007's Pete Starkey his company's strategy in China and the opportunities they are seeing in the region. They also discussed the company's two new products that will complement their European range.
China, Trump, and the Future
At NEPCON China, Hamed El-Abd of WKK and I-Connect007's Barry Matties discussed China’s fluctuating economy, the impact of the U.S. presidential election, the current state of electronics manufacturing in the region, and the overall craziness of doing business in modern day China.
Making Systems Smarter to Gain Visibility, Traceability, and Reduce Handling Errors
At the recent IPC APEX EXPO event in Las Vegas, Bjorn Dahle, president of KIC, talks about his views on automation, the technology improvements being made in reflow ovens, and some of the strategies to reduce handling errors in assembly lines.
A Preview of the 2016 International Microwave Symposium
The 2016 International Microwave Symposium (IMS) is taking place May 22–27 in San Francisco. I-Connect007's Barry Matties spoke with IMS’s Amanda Scacchitti about the upcoming show, the keynote speakers, and how IMS continues to put an emphasis on STEM education with their own STEM program for kids.
Reducing Setup Time to Provide More Uptime in Production
In an interview with I-Connect007 at the recent IPC APEX EXPO event in Las Vegas, Bob Bouchard, corporate marketing manager at BTU, talks about the latest developments in their products, how their technology is helping users reduce their setup times, and the impact of Industry 4.0 in the electronics assembly industry.
How Far Does It Make Sense to Automate?
There are often many advantages to automating the final assembly process, but how far does it make sense to automate? Is a fully automated process better than a semi-automated, or partially manual process? This article tells you more about the challenges and advantages of automation, and the right approach to adopt based on your operations.
EMS Rules of Automation & ROI
Are smaller EMS companies effectively dependent on manual labor and excluded from the innovation that automation and the computerization of the factory operation can bring? The answer is no because IoT is coming to the rescue. This article explains the cost of automation, how much to invest in automation, and the latest technology developments that will provide you manufacturing flexibility.
Strategies to Reduce Handling Errors in Your Rework Process
In this interview during the recent IPC APEX EXPO in Las Vegas, Donald Naugler, president and general manager of VJ Electronix, discusses rework challenges and strategies to help customers reduce handling errors in their processes. He also talks about automation, and the impact of Industry 4.0 in the electronics assembly industry.
Working Smarter Through a Proprietary Systems Strategy
From an IT perspective, EMS companies have two choices: select off-the-shelf systems and deal with support gaps if the systems don’t provide all the tools needed to manage the business, or buy an off-the-shelf core system and create highly customized solutions to address any support gaps. This article talks about the benefits of having the latter approach.
The Importance of Being Earnest (Educated)
This new column in SMT Magazine, titled "Jumping Off the Bandwagon," is dedicated to the continued development and improvement of the high-tech electronic product assembly industry, and the human component of that industry. For his first article, Tom Borkes talks about issues that, unless addressed, will continue to put product assembly at a disadvantage in high labor rate areas of the world.
To Outsource or Not to Outsource PCB Rework
There is a case to be made that outsourcing certain rework projects makes a lot of sense, especially in large, complex or highly time-sensitive rework projects. However, careful review of the suppliers' knowledge of standards and adherence to processes needs to be taken in to consideration prior to making the outsourcing call.
Cost vs. Cause: What is More Critical to EMS Profitability?
The reality of the market is that each major global EMS player will ask solder paste manufacturers to reduce price, rather than improving first pass yield. But the economics of this market trend are unsustainable. This article explains why achieving first pass yield can be a tremendous driver for maximizing the profitability of an EMS provider.
Best-Practice Process Preparation for PCB Assembly
In this high-pressure environment, process preparation systems need to be able to cope with every aspect and production, all machines and processes, without mistakes and without confusion, to scale the flexibility and responsiveness of the production operation in line with customer and market expectations.
Benefits of Improving Reflow and Screen Printing Processes
With a level playing field in terms of access to talent, technology, knowhow, infrastructure, and financial resources, how can an EMS company build a successful business year after year, decade after decade? Read this article to find out how one EMS player—through process improvements—manages to remain strong in this industry.
The Launch of a Lifetime: Catching up with Barry Lee Cohen
Dan Beaulieu catches up with industry veteran Barry Lee Cohen to talk about the new company he launched last month—Launch Communications; his vision; and why he took the chance in striking it out on his own.
RTW IPC APEX EXPO: Introbotix Highlights HF Tech for Nondestructive Testing
Brian Butler, president and CEO of Introbotix, speaks with I-Connect007 guest editor Bob Neves about using high-frequency test technology for insertion loss testing. He also talks about the HDP User Group and its current activities and initiatives.
RTW IPC APEX EXPO: Mentor Graphics Takes Manufacturing Operations to the Next Level
Dan Hoz, general manager of Mentor Graphics Valor Division, discusses with I-Connect007's Andy Shaughnessy how they are helping electronics manufacturers take their operations to the next level through their Valor IoT Manufacturing solutions. He talks about the OML and the Valor IoT Device, and how these solutions will help the electronics manufacturing industry to move to Industry 4.0.
RTW IPC APEX EXPO: Metcal on the Benefits of Customer Collaboration
Robert Roush, product support engineer at Metcal, discusses with I-Connect007 editor Andy Shaughnessy the importance of working together with customers, and how this approach can drive innovations in every market. They also explore the benefits of having digital solder feeders compared to traditional analog versions.
Selective Soldering: Design, Process Challenges and Practical Solutions
A SMART Group workshop at the Bromsgrove, UK, premises of equipment and process materials distributor APP Electronics, set out to provide the answers, with a programme combining technical presentations, live demonstrations and hands-on sessions, introduced and moderated by Nigel Burtt, senior electronics manufacturing engineer at Renishaw and SMART Technical Committee Chairman.
Supplier Spotlight: Transition Automation
In an interview with I-Connect007, Alden Lewis, vice president of sales at Transition Automation, discusses how they are tackling solder paste printing problems with squeegee technologies.
Selecting a Selective Soldering System, Part 1
So far in this series, we’ve covered stencil printers, pick and place machines, reflow ovens and multiple types of through-hole soldering. In this and the next couple of chapters, we’ll discuss selective soldering machines. It’s useful to start by understanding why and when selective soldering is used.
The Buyer’s Guide to Automation
Back in the 1990s when high-volume production was still enjoyed by most operations, the idea of replacing remaining manual operations with automated processes seemed like a great idea, but the technology at the time did not quite deliver on expectations. Today, the same goals for automation are once again in play; but this time, although technical capabilities have vastly improved, little high-volume is left.
Super Dry Discusses Tower System Developments
Rich Heimsch, director of the Americas for Super Dry-Totech, sits with I-Connect007's Andy Shaughnessy during the recent IPC APEX EXPO in Las Vegas to discuss the latest product developments at his company, as well as opportunities they are looking at.
Enabling Process Innovation through Test and Measurement Solutions
In an interview with I-Connect007, National Instruments Managing Director Matej Kranjc discussed how their platforms are enabling the development of intelligent systems of systems that help users make smarter business decisions, and how big data analysis is enabling process innovation in the electronics assembly line.
RTW IPC APEX EXPO: Rehm Discusses Advantages of Moving Heat Technology
Rehm Thermal Systems general manager Paul Handler speaks with I-Connect007 guest editor Steve Williams about the advantages of the moving heat chamber compared to traditional technology in the market today, and why their systems are all Industry 4.0-ready.
In a Culture of Continuous Improvement, Processes Continually Improve
In an interview with SMT Magazine, Etratech’s Mike Renneboog, manufacturing manager, and Robert Clarke, process manufacturing engineer, discussed their most significant challenge to improving SMT line productivity and quality, and the lessons they learned along the way.
RTW IPC APEX EXPO: Saline Lectronics Discusses How Industry 4.0 Can Give CMs the Edge
Jason Sciberras and Davina McDonnell of Saline Lectronics speak with I-Connect007 guest editor Steve Williams about how they embraced Industry 4.0 in their manufacturing line.
RTW IPC APEX EXPO: Kurtz Ersa Talks Latest Innovations
Ernie Grice of Kurtz Ersa North America speaks with I-Connect007 guest editor Mark Thompson about their latest innovations, including voidless reflow machines, selective soldering machines and rework systems, as well as a new paste printer that incorporates a 3D inspection system.
RTW IPC APEX EXPO: Indium Tackles Solder Voiding
Glen Thomas, product manager for solder pastes at Indium Corp., discusses with I-Connect007 Guest Editor Dick Crowe the primary problem in SMT lines today—solder voiding—and how they are helping their customers address this issue.
Taking the Gremlins Out of Your Process
Every step in your assembly line is supposed to be designed to perform optimally for you to have an efficient, reliable, robust and reproducible process. However, and as isolated as they may seem, "gremlins" sometimes appear and mess up the results of a batch. The latest issue of SMT Magazine features strategies that can help you address these issues.
RTW IPC APEX EXPO: Mentor Graphics Makes Internet of Manufacturing Affordable
Michael Ford, marketing development manager at Mentor Graphics, and I-Connect007 editor Andy Shaughnessy discuss the Open Manufacturing Language (OML), the challenges in supporting the hundreds of thousands of machines that are out there at shopfloors already, and how Mentor is making the Internet of Manufacturing affordable for everyone in the PCB assembly supply chain.
IPC APEX EXPO: Zentech's Matt Turpin Talks Strategies for Success in CM Industry
Zentech's Matt Turpin, named as one the electronics industry's Rising Stars by the IPC, speaks with I-Connect007 guest editor Dan Beaulieu on how to become successful in the electronics contract manufacturing space.
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