GEN3 Webinar, Part 8 Released: New IEC Standards—A Walk Through


Reading time ( words)

In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.  

The eighth episode, “New IEC Standards—A Walk Through” can be viewed in just over five minutes. Presenters discuss scope, measurement technique, the B52 and field gradient, dummy components and the test chamber. 

Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive or general industrial applications.  

Visit Predicting Reliability in Electronics and start watching, free, today! 

Share

Print


Suggested Items

GEN3 Webinar, Part 7 Released: SIR Test Coupon Design

01/05/2022 | I-Connect007 Editorial Team
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.

I-Connect007 and the Experts at GEN3 Release Episode 4 of Predicting Reliability in Electronics

12/07/2021 | I-Connect007 Editorial Team
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium. The fourth episode, “Testing Background,” can be viewed in under 11 minutes. Presenters share information on why the 1.56µg/cm2 NaCl equivalence was removed, test options, IPC-TM-650 method 2.6.3.7.1 and more.

Design to Production Flow: DFT and Test Coverage Using Industry 4.0 Principles to Produce Good Products

12/01/2021 | William Webb, ASTER Technologies
Achieving design for test (DFT) can be challenging for both design and test groups, as sometimes both expect that the other will be the one to manage DFT. The design and test groups might be in the same organization, or they could be an OEM vs. an EMS company. It works best if both the design and test groups are engaged in the process of DFT and trying to achieve the goal of the best test coverage and lowest rate of field returns.



Copyright © 2022 I-Connect007. All rights reserved.