Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For

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I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2.

This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.

Written by Ventec International Group’s Didier Mauve, Head of Global OEM and Technology, and Robert Art, Global Account Manager IMS/TIM, this book also addresses the key challenge of how to improve reliability of components as they become increasingly smaller and more efficient.

Peer reviewer Jan Pedersen, Director of Technology at NCAB Group, says, “IMS materials have been in the marketplace for decades now without a standard for the user's reference. This textbook is an important contribution to the understanding of IMS materials and, specifically, the focus on total thermal resistance and the new IPC Test Method TM-650 2.3.54.”

Readers will learn the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material; the effects of measurement errors and tolerance in dielectric thickness can also vary.

Download your free copy today at I-007eBooks.com. You can also view our full library at I-007eBooks.com.

Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available. 

Look for other exciting titles in this series, like:

• Stackups: The Design within the Design
• High Performance Materials
• System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
• …and more coming this summer

We hope you enjoy The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrate, Volume 2.

For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-7)

05/26/2023 | Andy Shaughnessy, Design007 Magazine

It’s been a busy week here at I-Connect007, an even busier week for PCB designers and manufacturers. This week, we published a variety of articles and news items. In this week’s wrap-up, we have an interview with Rex Rozario that is basically a historical look at the birth of commercial PCB manufacturing, and his involvement with the Rolling Stones in their early days. Then we bring you a look at trends in freight costs, which are—fortunately—heading southward right now.

05/26/2023 | Barry Matties, I-Connect007

David Thomas, master IPC trainer at EPTAC, says that the more you understand the work and technology that go into your processes and products, the better you can serve your customers. That includes knowing the basics.

05/19/2023 | Nolan Johnson, I-Connect007

This week, our must-reads include reporting on the new PCB support legislation, now submitted to the U.S. House of Representatives; financial results from two Tier 1 manufacturers, which readers read quite thoroughly; ESG in Asia Pacific; new features from Altium; global sourcing; and a “How I got here” interview with an up and coming industry expert.