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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the introduction of J8 No Clean Jetting Solder Paste. AIM has specifically formulated J8 No Clean Jetting Solder Paste for use in collaboration with a variety of jetting paste equipment manufacturers.
AIM’s J8 Jetting Paste has proven to provide consistent solder deposits as small as 200μm. J8 is fully compatible with all AIM no clean solder pastes for use in applications where combining jetted paste deposits with printed paste deposits is required. J8 has a novel activator system providing powerful, durable wetting action accommodating a wide range of profiles producing bright shiny joints without graping defects. J8 has reduced voiding to as low as
The development of J8 No Clean Jetting Solder Paste is another example of AIM’s commitment to engineering state of the art products to address emerging PCBA manufacturing technologies.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products including solder paste, liquid flux, cored wire, bar solder, epoxy, lead-free and halogen-free solder products. A recipient of many SMT industry awards, AIM is strongly committed to innovative research and development as well as providing customers with superior technical support, service and training.
Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.